RDK-249 Power Integrations, RDK-249 Datasheet - Page 23

• Manufacturer Part Number: RDK-249
• Description: KIT REF DESIGN PFS762HG
• Manufacturer: Power Integrations
• Series: HiperTFS®r

Specifications of RDK-249

• Main Purpose: Reference Design, PC Power Supply
• Embedded: No
• Utilized Ic / Part: TFS762HG
• Primary Attributes: 12V 25A, 5V 2.9A Outputs, 300 ~ 385 VDC Input
• Output Voltage: 5 V
• Input / Supply Voltage (max): 385 VDC
• Input / Supply Voltage (min): 300 VDC
• Duty Cycle (max): 50 %
• Mounting Style: Through Hole
• Output Current: 2.9 A
• Output Power: 14.5 W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Secondary Attributes: -
• Other names: 596-1398

Control Functions
Switching Frequency
- PC Main
Frequency Jitter
Modulation Rate
Remote-ON Main
BYPASS Pin
Remote-ON Current
BYPASS Pin Remote-
OFF Current Hysteresis
BYPASS Pin Latching
Shutdown Threshold
Main/Standby Remote-
ON Delay
Main/Standby Remote-
OFF Delay
Main/Standby Remote-
OFF Long Time Period
Soft-Start
High-Side Start-Up
Charge Time
Main Current Limit
at Start-Up
Soft-Start Period
www.powerint.com
Thermal Resistance
High-Side MOSFET (θ
Absolute Maximum Ratings
DRAIN Voltage High-Side MOSFET .......................-0.3 V to 530 V
DRAIN Peak Current High-Side: TFS757 ................... 3.1 (5.9)
DRAIN Voltage Low-Side MOSFET .................... -0.3 V to 725 V
DRAIN Peak Current Low-Side: TFS757 ................... 3.1 (5.9)
DRAIN Voltage Standby MOSFET ...................... -0.3 V to 725 V
DRAIN Peak Current Standby MOSFET ................ 1.20 (2.25)
Enable (EN) Pin Voltage ..................... ....................... -0.3 V to 9 V
Enable (EN) Pin Current ................. ................................. 100 mA
Feedback (FB) Pin Voltage ................. ...................... -0.3 V to 9 V
Parameter
JC
) TFS757, TFS758 .................... 15 °C/W
TFS759, TFS760 .................... 14 °C/W
TFS761, TFS762 .................... 13 °C/W
TFS763, TFS764 .................... 12 °C/W
Symbol
t
R(PERIOD)
I
I
I
I
t
f
f
BP(OFF)
t
BP(ON)
t
LIM(SS)
(1,5)
BP(SD)
M(MA)
R(OFF)
S(MA)
R(ON)
D(CH)
TFS758 ...................4.5 (8.4)
TFS759 ...................5.0 (9.3)
TFS760 ................. 5.7 (10.7)
TFS761 ..................6.1 (11.4)
TFS762 ..................6.4 (12.1)
TFS763 ................. 7.2 (13.4)
TFS764 ................. 8.3 (15.5)
TFS758 ...................4.5 (8.4)
TFS759 ...................5.0 (9.3)
TFS760 ................. 5.7 (10.7)
TFS761 ..................6.1 (11.4)
TFS762 ..................6.4 (12.1)
TFS763 ................. 7.2 (13.4)
TFS764................. 8.3 (15.5)
SOURCE = 0 V; T
T
J
(Unless Otherwise Specified)
= 25 °C
Conditions
V
See Note A
EN
= Open
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
J
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
= 0 °C to 100 °C
Peak-to-Peak Jitter
Low-Side MOSFET (θ
Notes:
1. All voltages referenced to SOURCE, T
Feedback (FB) Current ................... ................................. 100 mA
Line Sense (L) Pin Voltage ............................................-0.3 V to 9 V
Line Sense (L) Pin Current ............................................ .......100 ma
Reset (R) Pin Voltage ..................... ........................... -0.3 V to 9 V
Reset (R) Pin Current ..................................... .................... 100 mA
Bypass Supply (BP) Pin Voltage ............................... -0.3 V to 9 V
Bypass Supply (BP) Pin Current ................................... ..... 100 mA
High Side (VDDH) Supply Pin Voltage ................. -0.3 V to 13.4 V
High Side (VDDH) Supply Pin Current ..................................50 mA
Storage Temperature ............................................ -65 °C to 150 °C
Operating Junction Temperature
Lead Temperature
Notes:
1. All voltages referenced to SOURCE, T
2. Normally limited by internal circuitry.
3. 1/16 in. (1.59 mm) from case for 5 seconds.
4. The higher peak DRAIN current is allowed while the DRAIN
5. Maximum ratings specified may be applied one at a time,
Average
voltage is simultaneously less than 400 V.
without causing permanent damage to the product.
Exposure to Absolute Rating conditions for extended periods
of time may affect product reliability.
(3)
................................................................. 260 °C
JC
Min
3.2
62
13
) ................................................1 °C/W
(2)
15.5
Typ
250
115
TFS757-764HG
3.8
1.1
2.5
2.5
.......................-40 °C to 150 °C
66
80
14
4
A
J
= 25 °C.
= 25 °C.
Max
17.5
4.4
70
12
Units
kHz
mA
mA
mA
Hz
ms
ms
ms
ms
ms
Rev. C 02/11
%
23