RDK-249 Power Integrations, RDK-249 Datasheet - Page 32

• Manufacturer Part Number: RDK-249
• Description: KIT REF DESIGN PFS762HG
• Manufacturer: Power Integrations
• Series: HiperTFS®r

Specifications of RDK-249

• Main Purpose: Reference Design, PC Power Supply
• Embedded: No
• Utilized Ic / Part: TFS762HG
• Primary Attributes: 12V 25A, 5V 2.9A Outputs, 300 ~ 385 VDC Input
• Output Voltage: 5 V
• Input / Supply Voltage (max): 385 VDC
• Input / Supply Voltage (min): 300 VDC
• Duty Cycle (max): 50 %
• Mounting Style: Through Hole
• Output Current: 2.9 A
• Output Power: 14.5 W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Secondary Attributes: -
• Other names: 596-1398

Typical Performance Characteristics (cont.)
Rev. C 02/11
32
Figure 49.
Figure 51. High-Side MOSFET Drain Current vs. Drain Voltage.
Figure 47. Main Supply. Drain Capacitance vs. Drain Voltage.
1000
TFS757-764HG
10000
500
400
300
200
100
1000
100
100
10
0
Main Supply. Power vs. Drain Voltage.
0
0
0
Scaling Factors:
TFS757
TFS758
TFS759/760 0.33
TFS761
TFS762
TFS763/764 0.63
TFS757
TFS758
TFS759
TFS760
TFS761
TFS762
TFS763
TFS764
Scaling Factors:
100
Drain Voltage (VHD-VHS)
100
DRAIN Pin Voltage (V)
100
DRAIN Pin Voltage (V)
200
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
200
0.17
0.25
0.42
0.50
300
200
300
400 500 600
Scaling Factors:
TFS757
TFS758
TFS759
TFS760
TFS761
TFS762
TFS763
TFS764
400
66 kHz
300
500
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
400
700
600
Figure 48.
Figure 52. High-Side MOSFET Breakdown Voltage vs. Temperature.
Figure 50.
1.1
1.0
0.9
250
200
150
100
100
20
15
10
Standby Supply. Power vs. Drain Voltage.
5
0
0
-50 -25
High-Side MOSFET Drain Current vs. Drain Voltage.
0
0
STANDBY DRAIN Pin Voltage (V)
100
1
T
T
0
Temperature (°C)
J
J
DRAIN Voltage (V)
= 25 °C
= 100 °C
200
2
25
300
3
50
25 °C
132 kHz
Scaling Factors:
TFS757
TFS758
TFS759/760 0.33
TFS761
TFS762
TFS763/764 0.63
400 500 600
4
75 100 125 150
5
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0.17
0.25
0.42
0.50
100 °C
6
700
7