ISL21080-EVALZ Intersil, ISL21080-EVALZ Datasheet - Page 18

• Manufacturer Part Number: ISL21080-EVALZ
• Description: EVAL BOARD FOR ISL21080
• Manufacturer: Intersil

Specifications of ISL21080-EVALZ

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to
web to make sure you have the latest Rev.
5/12/10
4/29/10
4/14/10
3/25/10
4/6/10
4/1/10
DATE
REVISION
FN6934.4
FN6934.3
18
Changed Theta JA in the “Thermal Information” on page 3 from 170 to 275. Added Theta JC
and applicable note.
Incorrect Thermal information, needs to be re-evaluated and added at a later date when the
final data is available. Removed Theta JC and applicable note from “Thermal Information” on
page 3.
Corrected y axis label on Figure 9 from “V
Source/sink for 0.9V option changed from 7mA to 10mA
Line regulation condition for 0.9V changed from 2.7V to 2V
Line regulation typical for 0.9V option changed from 10 to 30µV/V
ΔT
Moved “Board Assembly Considerations” and “Special Applications Considerations” to page 14.
Deleted “Handling and Board Mounting” section since “Board Assembly Considerations” on
page 14 contains same discussion.
Added “Special Note: Post-assembly x-ray inspection may lead to permanent changes in
device output voltage and should be minimized or avoided.” to “ISL21080” on page 1
Figures 2 and 3 revised to show line regulation and Iin down to 2V.
Figures 4 and 5 revised to show Vin down to 2V.
Added “Initial accuracy can change 10mV or more under extreme radiation.” to Note 8 on
page 3.
1. page 3: Change Vin Min from 2.7 to 2.0
2. page 3: Change Iin Typ from 0.31 to 0.35
3. page 3: Change Line Reg Typ from 80 to 10
4. page 3: Change Load Reg Condition from 7mA to 10mA and -7mA to -10mA
5. page 3: Change Load Reg Typ for Source from 25 to 6 and Sink from 50 to 23.
6. page 3: Change Isc Typ from 50 to 30
7. page 3: Change tR from 4 to 1
8. Change Ripple Rejection typ for all options from -30 to -40
9. page 3: Change eN typ from 30 to 40V
10. page 3: Change VN typ from 50 to 10V
11. page 3: Change Noise Density typ from 1.1 to 2.2
12. page 3: Change Long Term Stability from 50 to 60
13. Added Figure 2 to 13 on page 8 to page 10 for 0.9V curves.
14. Added Figure 28 to 34 on page 13 to page 14 for other options Dropout curve.
15. page 1: Change Input Voltage Range for 0.9V option from TBD to 2V to 5.5V
16. Added latch up to “Absolute Maximum Ratings” on page 3
17. Added Junction Temperature to “Thermal Information” on page 3
18. Added JEDEC standards used at the time of testing for “ESD Ratings” on page 3
19. HBM in “Absolute Maximum Ratings” on page 3 changed from 5.5kV to 5kV
20. Added Theta JC and applicable note.
Throughout- Converted to new format. Changes made as follows:
Moved “Pin Configuration” and “Pin Descriptions” to page 2
Added “Related Literature*(see page 20)” to page 1
Added key selling feature graphic Figure 1 to page 1
Added "Boldface limits apply..." note to common conditions of Electrical Specifications tables
on page 3 through page 8. Bolded applicable specs. Added Note 12 to MIN MAX columns of all
Electrical Specifications tables.
Added ““Environmental Operating Conditions” to page 3 and added Note 4
Added “The process used for these reference devices is a floating gate CMOS process, and the
amplifier circuitry uses CMOS transistors for amplifier and output transistor circuitry. While
providing excellent accuracy, there are limitations in output noise level and load regulation due
to the MOS device characteristics. These limitations are addressed with circuit techniques
discussed in other sections.” on page 14
A
in Thermal Hysterisis conditions of 0.9V option changed from 165°C to 125°C
ISL21080
CHANGE
OUT
(V)” to “V
OUT
(µV)”
May 25, 2010
FN6934.4