NCP1529ASNT1GEVB ON Semiconductor, NCP1529ASNT1GEVB Datasheet - Page 4

• Manufacturer Part Number: NCP1529ASNT1GEVB
• Description: BOARD EVAL NCP1529
• Manufacturer: ON Semiconductor

Specifications of NCP1529ASNT1GEVB

• Design Resources: NCP1529ASNT1GEVB Schematic NCP1529ASNT1GEVB Gerber Files NCP1529ASNT1GEVB Bill of Materials
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at T
3. According to JEDEC standard JESD22−A108B.
4. This device series contains ESD protection and exceeds the following tests:
5. Latchup current maximum rating per JEDEC standard: JESD78.
6. JEDEC Standard: J−STD−020A.
7. In applications with high power dissipation (low V
8. To prevent permanent thermal damages, this device include a thermal shutdown which engages at 180°C (typ).
9. Board recommended TSOP−5 and UDFN6 layouts are described on Layout Considerations section.
MAXIMUM RATINGS
Moisture Sensitivity Level (Note 6)
Minimum Voltage All Pins
Maximum Voltage All Pins (Note 2)
Maximum Voltage EN
Thermal Resistance, Junction−to−Air (TSOP−5 Package)
Thermal Resistance using TSOP−5 Recommended Board Layout (Note 9)
Thermal Resistance, Junction−to−Air (UDFN6 Package)
Thermal Resistance using UDFN6 Recommended Board Layout (Note 9)
Operating Ambient Temperature Range (Notes 7 and 8)
Storage Temperature Range
Junction Operating Temperature (Notes 7 and 8)
Latchup Current Maximum Rating (T
ESD Withstand Voltage (Note 4)
Human Body Model
Machine Model
1200
1000
considerations − thermal dissipation vias, traces or planes and PCB material − can significantly improve junction to air thermal resistance
R
thermal limitation on maximum power dissipation allowed.
The following formula gives calculation of maximum ambient temperature allowed by the application:
T
Where:
800
600
400
200
A MAX
qJA
Human Body Model (HBM) per JEDEC standard: JESD22−A114.
Machine Model (MM) per JEDEC standard: JESD22−A115.
0
−40
(for more information, see design and layout consideration section). Environmental conditions such as ambient temperature T
= T
T
P
and R
J MAX
J
d
−20
is the junction temperature,
is the maximum power dissipated by the device (worst case of the application),
T
qJA
A
− (R
, AMBIENT TEMPERATURE (°C)
Figure 8. Power Derating
is the junction−to−ambient thermal resistance.
qJA
0
x P
d
)
20
Rating
A
= 85°C) (Note 5) Other Pins
40
TSOP−5
UDFN6
IN
60
, high I
http://onsemi.com
OUT
80
), special care must be paid to thermal dissipation issues. Board design
4
1200
1000
800
600
400
200
0
2.7
Figure 7. Maximum Output Current, T
UDFN6
Symbol
TSOP−5
3.2
V
V
R
R
MSL
V
V
T
T
Lu
max
max
qJA
qJA
T
esd
min
stg
A
j
V
IN
3.7
, INPUT VOLTAGE (V)
4.2
−55 to 150
−40 to 150
−40 to 85
V
Value
IN
$100
−0.3
A
300
110
220
200
7.0
2.0
40
+ 0.3
1
= 25°C.
4.7
A
5.2
= 455C
per IPC
°C/W
°C/W
Unit
mA
°C
°C
°C
kV
V
V
V
V
A
brings