1323XNSK Freescale Semiconductor, 1323XNSK Datasheet - Page 33

KIT DEV FOR 1323X_NETWORK

1323XNSK

Manufacturer Part Number
1323XNSK
Description
KIT DEV FOR 1323X_NETWORK
Manufacturer
Freescale Semiconductor
Type
Transceiver, 802.15.4r
Datasheets

Specifications of 1323XNSK

Frequency
2.4GHz
Interface Type
SPI
For Use With/related Products
MC1323x
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
12 Applications Information
Figure 10
the circuit include:
Freescale Semiconductor
Supply voltage for program/erase/read operation
Byte program time (random location)
Per Byte program time (burst mode) - excludes start/end
overhead
Sector erase time
Mass erase time
Program/erase endurance
Data retention @ 25°C
T
T = 25°C
L
to T
32 MHz reference oscillator crystal (Y1) is required, and must meet defined specifications
Pulldown resistor on signal PTA2 assures that devices does not enter factory test mode on power-up
Power supply voltage (V_IC) can range from 1.8 Vdc to 3.6 Vdc (see
RF Interface circuitry -
— 50/100 (unbal/bal) balun converts device differential, bidirectional RF port to single-ended
— Control signal RF_Bias switches RF reference voltage to the balun as required for TX or RX
— L1 provides impedance matching for MC1323x RF port
— C4 and L2 network provides a harmonic trap for out-of-band harmonics and spurs on TX
— A low-cost, copper pcb “F” antenna is shown. This is a common option, although other
H
illustrates a basic applications circuit based on the 123x-MRB development board. Features of
= –40°C to + 85°C
50-ohm antenna port
antennas such as a chip antenna or antenna module may also be used
Freescale provides a complete suite of design support material including
development hardware and software, reference manuals, and hardware
references designs for the MC1323x. The applications material presented
here is primarily for illustrative purposes.
Characteristic
RF circuitry at 2.4 GHz is very dependent on board layout and
component usage.
component value and use can vary based on customer application.
Mechanical design information for the MC1323x package and assembly
recommendations can be found in the Freescale IEEE 802.15.4 / ZigBee
MC1323x Advance Information, Rev. 0.0
Table 20. FLASH Characteristics
Figure 10
shows a typical RF configuration, however
NOTE
NOTE
Symbol
V
t
t
t
t
Sector
t
D_ret
Burst
Mass
BATT
prog
20,000
Min
100
1.6
100,000
Typical
20.1
40
20
20
Table 7
Max
for usage notes)
3.6
cycles
years
Unit
ms
ms
μs
μs
V
33

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