ADIS16204BCCZ Analog Devices Inc, ADIS16204BCCZ Datasheet - Page 21

• Manufacturer Part Number: ADIS16204BCCZ
• Description: IC ACCEL DIGITAL HI-G 16-LGA
• Manufacturer: Analog Devices Inc

Specifications of ADIS16204BCCZ

• Acceleration Range: ±37g, 70g
• Axis: X, Y
• Sensitivity: 17.125 LSB/mg, 8.407 LSB/mg
• Voltage - Supply: 3 V ~ 3.6 V
• Output Type: Digital
• Bandwidth: 400Hz
• Interface: SPI
• Mounting Type: Surface Mount
• Package / Case: 16-LGA
• No. Of Axes: 2
• Sensor Case Style: LGA
• No. Of Pins: 16
• Supply Voltage Range: 3V To 3.6V
• Operating Temperature Range: -40°C To +105°C
• Svhc: No SVHC (18-Jun-2010)
• Family Name: ADIS16204
• Package Type: LGA
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature (min): -40C
• Operating Temperature (max): 105C
• Operating Temperature Classification: Industrial
• Product Depth (mm): 8mm
• Product Height (mm): 5.2mm
• Product Length (mm): 8mm
• Mounting: Surface Mount
• Pin Count: 16
• Interface Type: SPI
• Sensitivity Per Axis: 17.125mg / LSB
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ADIS16204/PCBZ - BOARD EVAL FOR ADIS16204/PCB
• Lead Free Status / Rohs Status: Compliant

SECOND-LEVEL ASSEMBLY
The ADIS16204 can be attached to the second-level assembly
board using Sn63 (or equivalent) or a Pb-free solder. Figure 26
and Table 41 provide acceptable solder reflow profiles for each
solder type. Note that these profiles may not be the optimum
profile for the user’s application. In no case should 260°C be
exceeded. It is recommended that the user develop a reflow
profile based upon the specific application.
In general, keep in mind that the lowest peak temperature and
shortest dwell time above the melt temperature of the solder
results in less shock and stress to the product. In addition,
evaluating the cooling rate and peak temperature can result
in a more reliable assembly.
Table 41. Acceptable Solder Reflow Profiles
Profile Feature
Average Ramp Rate (T
Preheat
T
Time Maintained Above Liquidous Temperature (T
Peak Temperature (T
Time Within 5°C of Actual T
Ramp-Down Rate
Time 25°C to T
1
Per IPC/JEDEC J-STD-020C.
SMAX
Minimum Temperature (T
Maximum Temperature (T
Time (T
Ramp-Up Rate
Liquidous Temperature (T
Time (t
to T
L
L
SMIN to
)
P
T
SMAX
) (t
P
)
L
s
to T
)
P
)
p
SMAX
SMIN
L
)
)
)
1
L
)
Rev. B | Page 21 of 24
T
T
P
L
T
SMIN
T
SMAX
Sn63/Pb37
3°C/sec max
100°C
150°C
60 sec to 120 sec
3°C/sec
183°C
60 sec to 150 sec
240°C + 0°C/–5°C
10 sec to 30 sec
6°C/sec max
6 min max
Figure 26. Acceptable Solder Reflow Profiles
PREHEAT
t25°C TO PEAK
t
S
RAMP-UP
Condition
TIME
Pb-Free
3°C/sec max
150°C
200°C
60 sec to180 sec
3°C/sec
217°C
60 sec to 150 sec
260°C + 0°C/–5°C
20 sec to 40 sec
6°C/sec max
8 min max
RAMP-DOWN
t
P
t
L
ADIS16204
CRITICAL ZONE
T
L
TO T
P