DSPIC33FJ32MC204-E/PT Microchip Technology, DSPIC33FJ32MC204-E/PT Datasheet - Page 15
![IC, DSC, 16BIT, 32KB 40MHZ, 3.6V, TQFP44](/photos/6/82/68251/c04-076_pt_sml.jpg)
DSPIC33FJ32MC204-E/PT
Manufacturer Part Number
DSPIC33FJ32MC204-E/PT
Description
IC, DSC, 16BIT, 32KB 40MHZ, 3.6V, TQFP44
Manufacturer
Microchip Technology
Series
DsPIC33Fr
Datasheets
1.DSPIC33FJ32MC202-IMM.pdf
(320 pages)
2.DSPIC33FJ32MC202-IMM.pdf
(14 pages)
3.DSPIC33FJ32MC202-IMM.pdf
(14 pages)
4.DSPIC33FJ32MC204-IPT.pdf
(304 pages)
Specifications of DSPIC33FJ32MC204-E/PT
Core Frequency
40MHz
Core Supply Voltage
3.6V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
35
Flash Memory Size
32KB
Supply Voltage Range
3V To 3.6V
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
35
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 9x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
44-TQFP, 44-VQFP
Package
44TQFP
Device Core
dsPIC
Family Name
dSPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Data Bus Width
16 Bit
Number Of Programmable I/os
35
Interface Type
I2C/SPI/UART
On-chip Adc
9-chx10-bit|9-chx12-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
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- DSPIC33FJ32MC202-IMM PDF datasheet
- DSPIC33FJ32MC202-IMM PDF datasheet #2
- DSPIC33FJ32MC202-IMM PDF datasheet #3
- DSPIC33FJ32MC204-IPT PDF datasheet #4
- Current page: 15 of 320
- Download datasheet (5Mb)
2.0
2.1
Getting started with the dsPIC33FJ32MC202/204 and
dsPIC33FJ16MC304 family of 16-bit Digital Signal
Controllers (DSCs) requires attention to a minimal set
of device pin connections before proceeding with
development. The following is a list of pin names, which
must always be connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
• V
© 2011 Microchip Technology Inc.
(see
not used)
(see
(see
Connection
(see
Programming™ (ICSP™) and debugging purposes
(see
source is used
(see
reference for ADC module is implemented
Note:
Note 1: This data sheet summarizes the features
CAP
REF
DD
Section 2.2 “Decoupling
Section 2.2 “Decoupling
Section 2.3 “CPU Logic Filter Capacitor
Section 2.4 “Master Clear (MCLR)
Section 2.5 “ICSP
Section 2.6 “External Oscillator
+/V
DD
2: Some registers and associated bits
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS
Basic Connection Requirements
and V
REF
and AV
The AV
connected independent of the ADC
voltage reference source.
of the dsPIC33FJ32MC202/204 and
dsPIC33FJ16MC304 family of devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F/PIC24H Family Reference
Manual”, which is available from the
Microchip website (www.microchip.com).
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
this data sheet for device-specific register
and bit information.
dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304
- pins used when external voltage
(Vcap)”)
SS
SS
pins
DD
pins (even if the ADC module is
and AV
Pins”)
SS
Capacitors”)
Capacitors”)
pins must be
Pins”)
Pin”)
in
2.2
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
• Placement on the printed circuit board: The
• Handling high frequency noise: If the board is
• Maximizing performance: On the board layout
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have a resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
SS
is required.
Decoupling Capacitors
DD
, V
DS70283H-page 15
SS
, AV
DD
and
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