IS62WV1288BLL-55HLI INTEGRATED SILICON SOLUTION (ISSI), IS62WV1288BLL-55HLI Datasheet - Page 13

• Manufacturer Part Number: IS62WV1288BLL-55HLI
• Description: IC, SRAM, 1MBIT, 55NS, TSOP-32
• Manufacturer: INTEGRATED SILICON SOLUTION (ISSI)

Specifications of IS62WV1288BLL-55HLI

• Memory Size: 2Mbit
• Memory Configuration: 128K X 16
• Access Time: 55ns
• Supply Voltage Range: 2.5V To 3.6V
• Memory Case Style: TSOP
• No. Of Pins: 32
• Operating Temperature Range: -40°C To +85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PACKAGING INFORMATION
Plastic STSOP - 32 pins
Package Code: H (Type I)
Integrated Silicon Solution, Inc.
PK13197H32 Rev. B 04/21/03
1
Ref. Std.
Symbol Min
D1
N
A1
A2
A
C
D
E
S
b
e
L
α
13.20 13.60
11.70 11.90
Millimeters
0.05
0.95
0.17
0.14
7.90
0.30
—
Plastic STSOP (H - Type I)
0.28 Typ.
0°
0.50 BSC
Max
1.25
1.05
0.23
0.16
8.10
0.70
—
5°
32
0.0055
0.002
0.037
0.007
0.520
0.461
0.311
0.012
Min
—
0°
D1
0.020 BSC
0.011 Typ.
D
Inches
0.0063
0.049
0.041
0.009
0.535
0.469
0.319
0.028
Max
—
5°
L
Notes:
1. Controlling dimension: millimeters, unless otherwise
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E do not include mold flash protru-
4. Formed leads shall be planar with respect to one another
N
specified.
sions and should be measured from the bottom of the package.
within 0.004 inches at the seating plane.
α
E
SEATING PLANE
A2
C
A
S
A1
b
e