IS61C1024AL-12KLI INTEGRATED SILICON SOLUTION (ISSI), IS61C1024AL-12KLI Datasheet - Page 17
IS61C1024AL-12KLI
Manufacturer Part Number
IS61C1024AL-12KLI
Description
IC, SRAM, 1MBIT, 12NS, SOJ-32
Manufacturer
INTEGRATED SILICON SOLUTION (ISSI)
Datasheet
1.IS61C1024AL-12JLI.pdf
(17 pages)
Specifications of IS61C1024AL-12KLI
Memory Size
1Mbit
Memory Configuration
128K X 8
Access Time
12ns
Supply Voltage Range
4.5V To 5.5V
Memory Case Style
SOJ
No. Of Pins
32
Operating Temperature Range
-40°C To +85°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IS61C1024AL-12KLI
Manufacturer:
ISSI
Quantity:
1 000
Company:
Part Number:
IS61C1024AL-12KLI
Manufacturer:
ISSI
Quantity:
2 148
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IS61C1024AL-12KLI
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Quantity:
20 000
Company:
Part Number:
IS61C1024AL-12KLI-TR
Manufacturer:
ISSI
Quantity:
1 000
Company:
Part Number:
IS61C1024AL-12KLI-TR
Manufacturer:
ISSI
Quantity:
5 489
PACKAGING INFORMATION
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. C
06/13/03
Plastic TSOP-Type I
Package Code: T (32-pin)
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
S
No. Leads
Symbol
A1
A
B
C
D
E
H
S
e
L
18.30
19.80
MILLIMETERS
Min.
0.05
0.17
0.12
7.90
0.40
—
0°
0.50 BSC
0.25 REF
e
D
18.50
20.20
Max.
1.20
0.25
0.23
0.17
8.10
0.60
8°
32
0.002
0.007
0.005
0.311
0.720
0.780
0.016
Min.
B
—
0°
0.020 BSC
0.010 REF
N
1
INCHES
A
E
0.047
0.010
0.009
0.007
0.319
0.728
0.795
0.024
Max.
A1
8°
1-800-379-4774
H
SEATING PLANE
Notes:
1. Controlling dimension: millimeters, unless
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold
4. Formed leads shall be planar with respect
L
otherwise specified.
flash protrusions and should be measured
from the bottom of the package.
to one another within 0.004 inches at the
seating plane.
α
ISSI
C
®