PIC24FJ128GB210-I/BG Microchip Technology, PIC24FJ128GB210-I/BG Datasheet - Page 385

• Manufacturer Part Number: PIC24FJ128GB210-I/BG
• Description: IC, 16BIT MCU, PIC24F, 32MHZ, BGA-121
• Manufacturer: Microchip Technology
• Series: PIC® 24Fr

Specifications of PIC24FJ128GB210-I/BG

• Controller Family/series: PIC24
• No. Of I/o's: 84
• Ram Memory Size: 96KB
• Cpu Speed: 32MHz
• No. Of Timers: 5
• No. Of Pwm Channels: 9
• Core Size: 16 Bit
• Program Memory Size: 128KB
• Core Processor: PIC
• Speed: 32MHz
• Connectivity: I²C, IrDA, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 84
• Program Memory Type: FLASH
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 121-TFBGA
• Processor Series: PIC24FJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 96 KB
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 44
• Number Of Timers: 5
• Operating Supply Voltage: 2.2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, DM240001, MA240021
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 24 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
 2010 Microchip Technology Inc.
Architecture
Flash Memory Family
Product Group
Pin Count
Temperature Range
Package
Pattern
Microchip Trademark
Architecture
Flash Memory Family
Program Memory Size (KB)
Product Group
Pin Count
Tape and Reel Flag (if applicable)
Temperature Range
Package
Pattern
24
FJ
GB2 = General purpose microcontrollers with
06
10
I
PT
PT
MR = 64-lead (9x9x0.9 mm) QFN (Quad Flatpack, No Lead)
BG = 121-pin BGA package
Three-digit QTP, SQTP, Code or Special Requirements
(blank otherwise)
ES = Engineering Sample
= 16-bit modified Harvard without DSP
= -40C to +85C (Industrial)
= Flash program memory
= 64-pin
= 100-pin (TQFP)/121-pin (BGA)
= 100-lead (12x12x1 mm) TQFP (Thin Quad Flatpack)
= 64-lead, TQFP (Thin Quad Flatpack)
USB On-The-Go
PIC 24 FJ 256 GB2 10 T - I / PT - XXX
PIC24FJ256GB210 FAMILY
Examples:
a)
b)
PIC24FJ128GB206-I/PT:
PIC24F device with USB On-The-Go, 128-KB
program memory, 96-KB data memory, 64-pin,
Industrial temp., TQFP package.
PIC24FJ256GB210-I/PT:
PIC24F device with USB On-The-Go, 256-KB
program memory, 96-KB data memory, 100-pin,
Industrial temp., TQFP package.
.
DS39975A-page 385