LPC1112FHN33/101 NXP Semiconductors, LPC1112FHN33/101 Datasheet - Page 58

MCU, 32BIT, 16KFLASH, CORTEX-M0, 33HVQFN

LPC1112FHN33/101

Manufacturer Part Number
LPC1112FHN33/101
Description
MCU, 32BIT, 16KFLASH, CORTEX-M0, 33HVQFN
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC1112FHN33/101

Controller Family/series
ARM Cortex-M0
No. Of I/o's
28
Ram Memory Size
2KB
Cpu Speed
50MHz
No. Of Timers
4
Core Size
32bit
Program Memory Size
16KB
Oscillator Type
External, Internal
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1112FHN33/101
Manufacturer:
SAMSUNG
Quantity:
101
NXP Semiconductors
LPC1111_12_13_14
Product data sheet
11.5 Reset pad configuration
11.6 ElectroMagnetic Compatibility (EMC)
Radiated emission measurements according to the IEC61967-2 standard using the
TEM-cell method are shown for the LPC1114FBD48/302 in
Table 21.
V
[1]
Parameter
Input clock: IRC (12 MHz)
maximum
peak level
Input clock: crystal oscillator (12 MHz)
maximum
peak level
IEC level
IEC level
Fig 33. Reset pad configuration
DD
= 3.3 V; T
IEC levels refer to Appendix D in the IEC61967-2 Specification.
reset
[1]
[1]
ElectroMagnetic Compatibility (EMC) for part LPC1114FBD48/302 (TEM-cell
method)
amb
Frequency band
150 kHz - 30 MHz
30 MHz - 150 MHz
150 MHz - 1 GHz
-
150 kHz - 30 MHz
30 MHz - 150 MHz
150 MHz - 1 GHz
-
All information provided in this document is subject to legal disclaimers.
= 25
°
C.
Rev. 4 — 10 February 2011
GLITCH FILTER
20 ns RC
System clock =
12 MHz
−7
−2
4
O
−7
−2
4
O
R pu
V
32-bit ARM Cortex-M0 microcontroller
DD
24 MHz
−5
1
8
N
−7
1
7
N
LPC1111/12/13/14
V
DD
Table
21.
48 MHz
−7
10
16
M
−7
8
14
M
ESD
V
SS
V
ESD
DD
© NXP B.V. 2011. All rights reserved.
002aaf274
PIN
Unit
dBμV
dBμV
dBμV
-
dBμV
dBμV
dBμV
-
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