LPC1226FBD64/301 NXP Semiconductors, LPC1226FBD64/301 Datasheet - Page 36

• Manufacturer Part Number: LPC1226FBD64/301
• Description: MCU, 96K FLASH, CORTEX-M0, 64LQFP
• Manufacturer: NXP Semiconductors

Specifications of LPC1226FBD64/301

• Rohs Compliant: YES
• Featured Product: LPC122x Cortex-M0 Microcontrollers
• Core Processor: ARM Cortex-M0
• Core Size: 32-Bit
• Speed: 45MHz
• Connectivity: I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
• Number Of I /o: 55
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Controller Family/series: LPC1200
• No. Of I/o's: 55
• Ram Memory Size: 8KB
• Cpu Speed: 30MHz
• No. Of Timers: 4
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-5162; LPC1226FBD64/301

NXP Semiconductors
LPC122X
Objective data sheet
Fig 8.
Fig 9.
(1) System oscillator and system PLL disabled; IRC enabled.
(2) System oscillator and system PLL enabled; IRC disabled.
(mA)
I
DD
16
12
Active mode: Typical supply current I
Conditions: V
peripherals enabled in the SYSAHBCLKCTRL register (SYSAHBCLKCTRL = <tbd>).
clock frequencies (peripherals enabled)
Conditions: V
SYSAHBCLKCTRL register (SYSAHBCLKCTRL = <tbd>); all peripheral clocks disabled; internal
pull-up resistors disabled; BOD disabled.
Sleep mode: Typical supply current I
clock frequencies
8
4
0
−40
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DD(3V3)
DD(3V3)
(X)
X
Rev. 1.2 — 29 March 2011
−15
X
X
X
X
X
X
= 3.3 V; active mode entered executing code
= 3.3 V; sleep mode entered from flash; all peripherals disabled in the
X
X
<tbd>
10
X
DD
DD
versus temperature for different system
X
versus temperature for different system
32-bit ARM Cortex-M0 microcontroller
35
X
33 MHz
24 MHz
12 MHz
001aab173
4 MHz
1 MHz
X (X)
while(1){}
X
60
temperature (°C)
LPC122x
002aag024
© NXP B.V. 2011. All rights reserved.
from flash; all
85
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