LM2931Z-5.0 National Semiconductor, LM2931Z-5.0 Datasheet - Page 6

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LM2931Z-5.0

Manufacturer Part Number
LM2931Z-5.0
Description
IC, V REG LDO +5.0V, 2931, TO-92-3
Manufacturer
National Semiconductor
Datasheet

Specifications of LM2931Z-5.0

Primary Input Voltage
14V
Output Voltage
5V
Dropout Voltage Vdo
300mV
No. Of Pins
3
Output Current
100mA
Voltage Regulator Case Style
TO-92
Operating Temperature Range
-40°C To +85°C
Svhc
No
Output Voltage Fixed
5V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Reference Voltage
Output Voltage Range
Line Regulation
Load Regulation
Output Impedance
Quiescent Current
Output Noise Voltage
Output Impedance
Output Noise Voltage
Long Term Stability
Ripple Rejection
Dropout Voltage
Maximum Operational Input
Voltage
Maximum Line Transient
Reverse Polarity Input
Voltage, DC
Reverse Polarity Input
Voltage, Transient
Electrical Characteristics for Fixed 5V Version
V
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device
beyond its rated operating conditions.
Note 2: See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing is used.
Note 3: All limits are guaranteed for T
Note 4: The maximum power dissipation is a function of maximum junction temperature T
maximum allowable power dissipation at any ambient temperature is P
and the LM2931 will go into thermal shutdown. For the LM2931 in the TO-92 package, θ
package, θ
sink, θ
If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package: Using 0.5
square inches of copper area, θ
Note 5: Human body model, 100 pF discharged through 1.5 kΩ.
Electrical Characteristics for Adjustable Version
V
IN
IN
Quiescent Current
= 14V, I
= 14V, V
JA
is the sum of the package thermal resistance junction-to-case of 3˚C/W and the thermal resistance added by the heat sink and thermal interface.
Parameter
JA
Parameter
is 50˚C/W; in the TO-263 package, θ
O
OUT
= 10mA, T
= 3V, I
O
JA
J
= 25˚C, C2 = 100 µF (unless otherwise specified) (Note 2)
= 10 mA, T
is 50˚C/W; with 1 square inch of copper area, θ
100mA
100Hz -10kHz
I
−40˚C ≤ T
I
10Hz -100kHz, C
f
I
I
R
T = 1ms, τ ≤ 100ms
V
T = 1ms, τ ≤ 100ms, R
J
O
O
O
O
O
O
L
= 25˚C (standard type face) or over the full operating junction temperature range of −40˚C to +125˚C (bold type face).
≤ 10mA, 6V ≤ V
= 100mA, V
= 120 Hz
= 10mA
= 100mA
I
Measured from V
V
5 mA ≤ I
100 mA
I
I
During Shutdown R
10 Hz–100 kHz
= 500Ω, V
≥ −0.3V, R
O
O
O
OUT
≤ 100 mA, −40˚C ≤ T
= 10 mA
= 100 mA
DC
J
JA
+ 0.6V ≤ V
= 25˚C, R1 = 27k, C2 = 100 µF (unless otherwise specified) (Note 2)
J
and 10mA
DC
is 73˚C/W; and in the 6-Bump micro SMD package θ
O
≤ 125˚C
O
≤ 100 mA
Conditions
and 10 mA
L
IN
≤ 5.5V,
= 500Ω
OUT
= 14V, T
IN
IN
OUT
rms
≤ 26V
= 100µF
≤ 26V
L
Conditions
L
,
D
= 500Ω
to Adjust Pin
= 500Ω
rms
= (T
J
j
= 25˚C
, 100 Hz–10 kHz
≤ 125˚C, R1 = 27k
Jmax
6
− T
JA
A
is 37˚C/W; and with 1.6 or more square inches of copper area, θ
)/θ
JA
JA
. If this dissipation is exceeded, the die temperature will rise above 150˚C
Jmax
is 195˚C/W; in the SO-8 package, θ
0.05
Typ
200
500
−30
−80
0.4
0.3
15
20
80
33
70
, total thermal resistance θ
LM2931A-5.0
(Continued)
JA
(Note 3)
is 290˚C/W. If the TO-220 package is used with a heat
Limit
−15
−50
1.0
0.2
0.6
30
55
26
60
5
1.20
Typ
100
0.2
0.3
0.4
0.8
40
15
JA
0.05
Typ
200
500
−30
−80
, and ambient temperature T
0.4
0.3
15
20
80
33
70
LM2931-5.0
JA
Limit
is 160˚C/W, and in the TO-220
1.26
1.14
1.32
1.08
1.5
24
3
1
1
1
(Note 3)
Limit
−15
−50
1.0
0.2
0.6
26
50
mV/V
JA
µV
mA
mA
Units
%
mΩ/V
Limit
V
V
V
V
V
V
is 32˚C/W.
mA
mV/1000
MAX
MAX
MAX
rms
MIN
MIN
MIN
MAX
mA
mA
MAX
MAX
mA
dB
Units
µV
V
V
V
V
V
MAX
A
mΩ
/V
MAX
. The
hr
MIN
MIN
MIN
MIN
MAX
MAX
MIN
rms
MIN

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