DSPIC30F1010T-30I/MM Microchip Technology, DSPIC30F1010T-30I/MM Datasheet - Page 45
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DSPIC30F1010T-30I/MM
Manufacturer Part Number
DSPIC30F1010T-30I/MM
Description
6KB, Flash, 256bytes-RAM, 30MIPS, 21I/O, 16-bit Family,nanoWatt 28 QFN-S 6x6mm T
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.AC164335.pdf
(286 pages)
2.DM300023.pdf
(22 pages)
3.DM300023.pdf
(18 pages)
4.DSPIC30F2011-20ISO.pdf
(66 pages)
5.DSPIC30F2011-20IP.pdf
(26 pages)
6.DSPIC30F1010-30ISO.pdf
(26 pages)
7.DSPIC30F1010-30ISO.pdf
(50 pages)
Specifications of DSPIC30F1010T-30I/MM
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
6KB (2K x 24)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-QFN
Data Bus Width
16 bit
Data Ram Size
256 B
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
21
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240002, DM300023, DM330011
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 6 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300023 - KIT DEMO DSPICDEM SMPS BUCK
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
DSPIC30F1010T-30I/MMTR
13.0
Table 13-1
requirements.
TABLE 13-1:
© 2010 Microchip Technology Inc.
AC/DC Characteristics
D110
D112
D113
D001
D002
D031
D041
D080
D090
D012
P1
P1A
P1B
P2
P3
P4
P4A
P5
P6
P7
P8
P9a
P9b
P10
Param.
No.
AC/DC CHARACTERISTICS
AND TIMING REQUIREMENTS
lists AC/DC characteristics and timing
V
I
I
V
V
V
V
V
V
C
T
T
T
T
T
T
T
T
T
T
T
T
T
T
PP
DDP
OL
OH
PGC
PGCL
PGCH
SET
HLD
DLY
DLY
DLY
SET
HLD
DLY
DLY
DLY
DLY
IHH
DD
DDBULK
IL
IH
IO
Sym
1
1
1
2
2
3
4
5
6
1
2
AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS
A
Programming Voltage on MCLR
Programming Current on MCLR
Supply Current during programming
Supply voltage
Supply voltage for Bulk Erase
programming
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Capacitive Loading on I/O Pin (PGD)
Serial Clock (PGC) Period
Serial Clock (PGC) Low Time
Serial Clock (PGC) High Time
Input Data Setup Time to Serial Clock ↓
Input Data Hold Time from PGC ↓
Delay between 4-bit Command and
Command Operand
Delay between 4-bit Command Operand
and Next 4-bit Command
Delay between Last PGC ↓ of Command
Byte to First PGC ↑ of Read of Data
Word
V
Input Data Hold Time from MCLR ↑
Delay between Last PGC ↓ of Command
Byte to PGD ↑ by Programming
Executive
Programming Executive Command
Processing Time
Delay between PGD ↓ by Programming
Executive to PGD Released by
Programming Executive
PGC Low Time After Programming
DD
↑ Setup Time to MCLR ↑
Characteristic
Standard Operating Conditions
(unless otherwise stated)
Operating Temperature: 25° C is recommended
V
0.8 V
0.8 V
DD
V
Min
100
100
500
400
3.0
3.0
40
40
15
15
40
40
20
20
10
15
—
—
—
—
—
SS
– 0.7
DD
DD
0.2 V
Max
V
V
5.5
5.5
0.6
30
30
50
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
5
DD
DD
SS
Units
mA
mA
mA
ms
ms
ms
pF
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
V
V
V
V
V
V
V
DS70284C-page 45
Row Erase
Program
memory
Bulk Erase
I
I
To meet AC
specifications
OL
OH
Conditions
= 8.5 mA
= -3.0 mA
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