DSPIC30F1010T-30I/MM Microchip Technology, DSPIC30F1010T-30I/MM Datasheet - Page 46
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DSPIC30F1010T-30I/MM
Manufacturer Part Number
DSPIC30F1010T-30I/MM
Description
6KB, Flash, 256bytes-RAM, 30MIPS, 21I/O, 16-bit Family,nanoWatt 28 QFN-S 6x6mm T
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.AC164335.pdf
(286 pages)
2.DM300023.pdf
(22 pages)
3.DM300023.pdf
(18 pages)
4.DSPIC30F2011-20ISO.pdf
(66 pages)
5.DSPIC30F2011-20IP.pdf
(26 pages)
6.DSPIC30F1010-30ISO.pdf
(26 pages)
7.DSPIC30F1010-30ISO.pdf
(50 pages)
Specifications of DSPIC30F1010T-30I/MM
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
6KB (2K x 24)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-QFN
Data Bus Width
16 bit
Data Ram Size
256 B
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
21
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240002, DM300023, DM330011
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 6 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300023 - KIT DEMO DSPICDEM SMPS BUCK
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
DSPIC30F1010T-30I/MMTR
TABLE 13-1:
DS70284C-page 46
AC/DC Characteristics
P11
P12
P13
P14
P15
P16
P17
P18a
P18b
P19a
P19b
Param.
No.
T
T
T
T
T
T
T
T
Tprog
T
T
ERA
ERA
DLY
R
VALID
DLY
HLD
KEY
KEY
PROG
Sym
7
8
3
1
2
AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS (CONTINUED)
Delay to allow Bulk Erase to Occur
MCLR Rise Time to Enter ICSP™ mode
Data Out Valid from PGC ↑
Delay between Last PGC ↓ and MCLR ↓
MCLR ↓ to V
Delay from First MCLR ↓ to First PGC ↑
for Key Sequence on PGD
Delay from Last PGC ↓ for Key Sequence
on PGD to Second MCLR ↑
Row Programming cycle time
Row programming cycle time
Bulk/Row Erase cycle time
Bulk/Row Erase cycle time
DD
Characteristic
↓
Standard Operating Conditions
(unless otherwise stated)
Operating Temperature: 25° C is recommended
Min
200
0.8
0.8
10
40
40
—
—
0
1
1
Max
100
1.0
2.6
2.6
—
—
—
—
—
4
4
© 2010 Microchip Technology Inc.
Units
ms
ms
ms
ms
ms
ms
ns
ns
ns
ns
s
ICSP mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
Conditions
—
—
—
—
—
—
—