IAM-91563-TR1 Avago Technologies US Inc., IAM-91563-TR1 Datasheet - Page 7

• Manufacturer Part Number: IAM-91563-TR1
• Description: IC,Downconverter,GAAS,TSSOP,6PIN,PLASTIC
• Manufacturer: Avago Technologies US Inc.

Specifications of IAM-91563-TR1

• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Parameters considered to be the most important to
system performance are bounded by minimum or
maximum values. For the IAM-91563, these param-
eters are: Conversion Gain (G
and Device Current (I
parameters is 100% tested.
Values for most of the parameters in the table of
Electrical Specifications that are described by typical
data are the mathematical mean (µ), of the normal
distribution taken from the characterization data. For
parameters where measurements or mathematical av-
eraging may not be practical, such as the Typical
Reflection Coefficients table or performance curves,
the data represents a nominal part taken from the
“center” of the characterization distribution. Typical
values are intended to be used as a basis for electrical
design.
To assist designers in optimizing not only the immedi-
ate circuit using the IAM-91563, but to also optimize
and evaluate trade-offs that affect a complete wireless
system, the standard deviation (σ) is provided for
many of the Electrical Specifications parameters (at
25°) in addition to the mean. The standard deviation is
a measure of the variability about the mean. It will be
recalled that a normal distribution is completely
described by the mean and standard deviation.
Standard statistics tables or calculations provide the
probability of a parameter falling between any two
values, usually symmetrically located about the mean.
Referring to Figure 12 for example, the probability of a
parameter being between ±1σ is 68.3%; between ±2σ is
95.4%; and between ±3σ is 99.7%.
Figure 19. Normal Distribution.
Phase Reference Planes
The positions of the reference planes used to specify
Reflection Coefficients for this device are shown in
Figure 20. As seen in the illustration, the reference
planes are located at the point where the package leads
contact the test circuit.
-3σ
-2σ
-1σ
Parameter Value
d
68%
95%
99%
Mean (µ)
(typical)
). Each of these guaranteed
test
+1σ +2σ +3σ
), Noise Figure (NF
test
),
Figure 20. Phase Reference Planes.
RF Layout
An RF layout similar to the one in Figure 21 is suggested
as a starting point for microstripline designs using the
IAM-91563 mixer. This layout shows the capacitor for
the Source Bypass pin and the optional resistor used to
increase bias current. Adequate grounding is impor-
tant to obtain maximum performance and to maintain
stability. Both of the ground pins of the MMIC should
be connected to the RF groundplane on the backside of
the PCB by means of plated through holes (vias) that
are placed near the package terminals. As a minimum,
one via should be located next to each of the ground
pins to ensure good RF grounding. It is a good practice
to use multiple vias to further minimize ground path
inductance.
Figure 21. RF Layout.
It is recommended that the PCB pads for the ground
pins not be connected together underneath the body of
the package. PCB traces hidden under the package
cannot be adequately inspected for SMT solder quality.
PCB Material
FR-4 or G-10 printed circuit board materials are a good
choice for most low cost wireless applications. Typical
board thickness is 0.020 to 0.031 inches. Thicknesses
greater than 0.031 inch began to introduce excessive
inductance in the ground vias. The width of the 50Ω
TEST CIRCUIT
REFERENCE
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PLANES