PIC18F2523-E/SP Microchip Technology, PIC18F2523-E/SP Datasheet - Page 7

• Manufacturer Part Number: PIC18F2523-E/SP
• Description: 32KB, Flash, 1536bytes-RAM, 25I/O, 8-bit Family,nanoWatt 28 SPDIP .300in TUBE
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2523-E/SP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 25
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 1.5 KB
• Interface Type: EUSART, I2C, MSSP, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 4
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM163022, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 10 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM163025 - PIC DEM FULL SPEED USB DEMO BRD
• Lead Free Status / Rohs Status: Details

Table of Contents
1.0
2.0
3.0
4.0
5.0
Appendix A: Revision History............................................................................................................................................................... 45
Appendix B: Device Differences .......................................................................................................................................................... 45
Appendix C: Conversion Considerations ............................................................................................................................................. 46
Appendix D: Migration from Baseline to Enhanced Devices................................................................................................................ 46
Appendix E: Migration from Mid-Range to Enhanced Devices ............................................................................................................ 47
Appendix F: Migration from High-End to Enhanced Devices ............................................................................................................... 47
Index ................................................................................................................................................................................................... 49
The Microchip Web Site ....................................................................................................................................................................... 51
Customer Change Notification Service ................................................................................................................................................ 51
Customer Support ................................................................................................................................................................................ 51
Reader Response ................................................................................................................................................................................ 52
Product Identification System .............................................................................................................................................................. 53
© 2009 Microchip Technology Inc.
Device Overview .......................................................................................................................................................................... 9
12-Bit Analog-to-Digital Converter (A/D) Module ....................................................................................................................... 25
Special Features of the CPU...................................................................................................................................................... 35
Electrical Characteristics ............................................................................................................................................................ 37
Packaging Information................................................................................................................................................................ 43
PIC18F2423/2523/4423/4523
DS39755C-page 7