PIC18F2585-E/SO Microchip Technology, PIC18F2585-E/SO Datasheet - Page 457
PIC18F2585-E/SO
Manufacturer Part Number
PIC18F2585-E/SO
Description
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,SOP,28PIN,PLASTIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F2221-ISO.pdf
(46 pages)
3.PIC18F4585-IPT.pdf
(482 pages)
4.PIC18F4585-IPT.pdf
(14 pages)
5.PIC18F4585-IPT.pdf
(8 pages)
6.PIC18F4585-IPT.pdf
(12 pages)
7.PIC18F4585-IPT.pdf
(4 pages)
Specifications of PIC18F2585-E/SO
Rohs Compliant
YES
Core Processor
PIC
Core Size
8-Bit
Speed
25MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
48KB (24K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.25K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-SOIC (7.5mm Width)
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3.25 KB
Interface Type
I2C, SPI, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
28
Number Of Timers
1 x 8
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163011, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3-DB18F4680 - BOARD DAUGHTER ICEPIC3
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F2585-E/SO
Manufacturer:
Microchip Technology
Quantity:
135
- PIC16F616T-ISL PDF datasheet
- PIC18F2221-ISO PDF datasheet #2
- PIC18F4585-IPT PDF datasheet #3
- PIC18F4585-IPT PDF datasheet #4
- PIC18F4585-IPT PDF datasheet #5
- PIC18F4585-IPT PDF datasheet #6
- PIC18F4585-IPT PDF datasheet #7
- Current page: 457 of 482
- Download datasheet (9Mb)
29.2
The following sections give the technical details of the packages.
© 2007 Microchip Technology Inc.
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Package Details
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
PIC18F2585/2680/4585/4680
Dimension Limits
Preliminary
Units
A2
A1
E1
eB
b1
N
D
A
E
b
e
L
c
e
1.345
.120
.015
.290
.240
.008
.040
.014
A2
MIN
.110
E1
–
–
L
.100 BSC
INCHES
1.365
NOM
.050
.018
.135
.310
.285
.130
.010
28
–
–
–
Microchip Technology Drawing C04-070B
eB
E
1.400
MAX
.070
.022
.200
.150
.335
.295
.150
.015
.430
–
DS39625C-page 455
c
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