ISL76683AROZ-T7 Intersil, ISL76683AROZ-T7 Datasheet - Page 14

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ISL76683AROZ-T7

Manufacturer Part Number
ISL76683AROZ-T7
Description
DIGITAL LIGHT SENSOR ADC 6ODFN
Manufacturer
Intersil
Datasheet

Specifications of ISL76683AROZ-T7

Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Suggested PCB Footprint
Footprint pads should be a nominal 1-to-1 correspondence with
package pads. Since ambient light sensor devices do not
dissipate high power, heat dissipation through the exposed pad is
not important; instead, similar to DFN or QFN, the exposed pad
provides robustness in board mount process. Intersil
recommends mounting the exposed pad to the PCB, but this is
not mandatory.
Layout Considerations
The ISL76683 is relatively insensitive to layout. Like other I
devices, it is intended to provide excellent performance even in
significantly noisy environments. There are only a few
considerations that will ensure best performance.
Route the supply and I
sources of noise. Use two power-supply decoupling capacitors,
4.7µF and 0.1µF, placed close to the device.
ISL76683
t
L
2
C traces as far as possible from all
D
2
14
>1.5mm
D
LENS
2.00mm
FIGURE 16. WINDOW WITH LIGHT GUIDE/PIPE
FIGURE 17. SENSOR LOCATION DRAWING
LIGHT PIPE
0.29mm
1
2
3
ISL76683
2
C
0.46mm
Typical Circuit
A typical application for the ISL76683 is shown in Figure 18. The
ISL76683’s I
device can be tied onto a system’s I
I
Soldering Considerations
Convection heating is recommended for reflow soldering; direct
infrared heating is not recommended. The plastic ODFN package
does not require a custom reflow soldering profile, and is
qualified to +260°C. A standard reflow soldering profile with a
+260°C maximum is recommended.
2.10mm
2
C compliant devices.
2
C address is internally hardwired as 1000100. The
6
5
4
0.56mm
2
C bus together with other
D
2
March 17, 2011
D
LENS
FN7697.2

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