C1608X7R1C103K TDK Corporation, C1608X7R1C103K Datasheet - Page 11

• Manufacturer Part Number: C1608X7R1C103K
• Description: CAP CER 10000PF 16V X7R 10% 0603
• Manufacturer: TDK Corporation
• Series: Cr

Specifications of C1608X7R1C103K

• Voltage - Rated: 16V
• Capacitance: 10000pF
• Tolerance: ±10%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: Low ESR
• Applications: General Purpose
• Package / Case: 0603 (1608 Metric)
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Thickness: 0.037" (0.95mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Other names: 445-6855-2

TDK Multilayer Ceramic Chip Capacitors
Application Manual
Cautions in removing from double-sided circuit board
Double-sided circuit boards are singulated into separate unit circuit
boards, but if excess flex stress is placed on the circuit boards at that time,
cracks may occur in TDK multilayer ceramic chip capacitors. Use the
diagram below to ensure that stress suppression during board separation
is adequate.
Relationship between chip position and flex stress during board separation
Point
Direction in
which chip
mounting
surface is
bent.
Chip
orientation
Distance from
slit
Cautions when resin coating
After installing the TDK multilayer ceramic chip capacitors on the circuit
board, resin may be coated on the device-mounting surface for the
purposes of preventing damage from moisture and dust, or when potting,
follow the items below in selecting the resin.
1) Take full precautions to ensure that the curing process or the natural
drying state is not one in which decomposing gases or reactive gases are
present. Being placed in such environments may cause the destruction
of the chips because the metals that are part of the TDK MLC chip capacitor
structure will react (such as the hydrogen absorption effect of palladium)
with the gas.
2) The producing of large amounts of stress (this trend is generally
pronounced in hard polymer resins) by the thermal expansion and
contraction of the resin in the curing process may destroy the TDK multilayer
ceramic chip capacitors. Soft polymers should be used as an under coating.
Effects and conditions of other operations
The stress on TDK multilayer ceramic chip capacitors when they are
installed will differ according to solder quantity, board material and other
conditions, below is shown examples of data for all conditions of stress
that occurs to TDK multilayer ceramic chip capacitors. Please use this to
improve circuit reliability.
52
Locations to avoid
Hold chip mounting
surface upward and
bend upward
Set vertically in
relationship to slit
Installing close to slit
Recommended locations
Holding chip mounting
surface downward and
bending downward.
Set horizontally in
relationship to slit
Installing in center of
circuit board units
Chip thickness
( T )
Solder amount and flex strength
Test method
Relation between solder amount and flex strength
(C1005X7R1C103K)
Relation between solder amount and flex strength
(C1608X7R1C103K)
Relation between solder amount and flex strength
(C2012X7R1H103K)
100
100
100
80
60
40
20
60
80
60
40
20
80
40
20
0
0
0
0
0
0
Right amount of solder
Too much solder
Too much solder
2
2
2
Glass epoxy circuit board
Too much solder
Right amount of solder
Too much solder
Too little solder
4
Flex (mm)
4
4
Flex (mm)
40
Flex (mm)
R230
Right amount of solder
Right amount of solder
6
6
6
Too little solder
Too little solder
Too little solder
20
8
8
8
45
C meter
10
10
10
45
Circuit board thickness
( t=1.6)
in millimeters
Flex