C1608X7R1C103K TDK Corporation, C1608X7R1C103K Datasheet - Page 8

• Manufacturer Part Number: C1608X7R1C103K
• Description: CAP CER 10000PF 16V X7R 10% 0603
• Manufacturer: TDK Corporation
• Series: Cr

Specifications of C1608X7R1C103K

• Voltage - Rated: 16V
• Capacitance: 10000pF
• Tolerance: ±10%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: Low ESR
• Applications: General Purpose
• Package / Case: 0603 (1608 Metric)
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Thickness: 0.037" (0.95mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Other names: 445-6855-2

TDK Multilayer Ceramic Chip Capacitors
Application Manual
Important points in selecting cream solder
1) Compatible with consistent printing or dispensing volume on PC pad
2) The solder surface area must not spread more than necessary in the
3) Adequate solderability.
4) The flux residue must be minimized and solder balls must be eliminated.
5) Flux residue must not adversely affect the circuit or other electronic
6) Must have an adhesion that allows parts mounting in stable state with
The tombstone effect (Tombstone effect)
TDK multilayer ceramic chip capacitors are small and lightweight, and the
tombstone effect, the standing up of capacitors that occurs during reflow
soldering, must be addressed. This effect can be reduced by employing
such measures as reducing land dimensions, applying adequate preheat,
optimizing solder volume, ensuring accurate placement, and providing
equal heating to both terminations during soldering.
The tombstone effect (drawbridge effect)
Before soldering
After soldering
Recommended steps to prevent the tombstone effect
1) Accurate chip placement: Give consideration to reducing any offset in
2) Orientation of component: Give consideration when designing P.C.
Position in which the tombstone effect rate is low
(both terminal electrode temperatures are balanced)
dimensions.
reflow preheating process after printing or dispensing.
parts.
high reliability and no change in contact resistance.
position with relation to the PC board pattern. The tombstone effect
occurs more frequently when the direction of chip position offset is the
same as the reflow direction (direction of forward circuit board movement).
board pattern to ensure the direction of chip mounting (lengthwise
direction) at right angles to the reflow direction.
Reflow direction
Position in which the occurrence of the tombstone effect is high
(temperature of both terminal electrodes easily gets out of balance).
3) Relation between placement and parts with large heat capacity
a: Reflow direction and circuit board direction
Circuit board direction in which the rate of the tombstone effect occurrence
is low (reduced difference in temperature between both terminal electrodes)
Circuit board direction in which the rate of the tombstone effect occurrence
is high (imbalance in temperatures between both terminal electrodes).
b: Distance between parts with large heat capacity
c: Relation in positions between parts with large heat capacity
Position in which the tombstone effect is low (small difference in temperature
between both terminal electrodes)
Position in which the tombstone effect is high (imbalance easily occurring
in temperature between both terminal electrodes)
4) P.C. pad dimension area
Design the pad dimensions so that the land area is as small as possible
and that each land is positioned such that it receives a uniform quantity
of solder.
When installing parts with a large heat capacity on the same circuit
board as the TDK multilayer ceramic chip capacitors. Orient the circuit
board so that the parts with high heat capacity go into the reflow furnace
first and that will help to suppress the rate of the tombstone effect
occurrence.
To reduce the rate of tombstone effect occurrence, design the patterns
so that the parts with large heat capacity are as close as possible to the
TDK multilayer ceramic chip capacitors.
The occurrence of the tombstone effect can be held down by placing
the TDK multilayer ceramic chip capacitors in proximity with the sides
of the parts with large heat capacity. At this time, too, place the capacitors
as close as possible to the parts with large heat capacity and make sure
that the chip orientation is at right angles to the reflow direction.
Reflow direction
Reflow direction
Reflow direction
Reflow direction
Reflow direction
49