S1048-TAPE-1X100-FT Tyco Electronics, S1048-TAPE-1X100-FT Datasheet - Page 3

TAPE, SEALANT, THERMOPLASTIC, 1INX100FT

S1048-TAPE-1X100-FT

Manufacturer Part Number
S1048-TAPE-1X100-FT
Description
TAPE, SEALANT, THERMOPLASTIC, 1INX100FT
Manufacturer
Tyco Electronics

Specifications of S1048-TAPE-1X100-FT

Tape Backing Material
Thermoplastic
Roll Length
100ft
Adhesive Material
Thermoplastic
Tape Type
Sealing
Width
1"
Product
Tape
Size
1 in x 100 ft
Description/function
Hot Melt Polyolefin Adhesive
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
SPECIFICATION RT-1050/3, Issue 4
NOTE 1
NOTE 2
NOTE 3
If this document is printed it becomes uncontrolled. Check for the latest revision.
SOFTENING POINT
Dry S-1048 tape overnight at room temperature in a vacuum chamber to reduce void formation during
pressing. Lay a cross hatch of tape strips in a mold window 2" x 2" x 5/32". Place Teflon* coated glass cloth
between the backing plate and the mold, insert in a press at 150ºC at minimum contact pressure for a 1
minute preheat, then increase the pressure to 20,000 lbs. ram force for 1 additional minute. Transfer to a cold
press at 20,000 lbs. ram force until cool. Remove and inspect the slab. If substantially void free, punch two
5/8" diameter disks and two 25/32" diameter disks. Fit one disk of each size in a shouldered brass ring, then
insert one of the brass rings in a 2" diameter support ring. Place the assembly, bottom down, on a 0.060"
(1/16") backing plate covered with a sheet of Teflon coated glass cloth. Put a second sheet of Teflon coated
glass cloth and a second backing plate (an 8" x 8" x 1/16" backing plate should weigh about 485 gms.) on
top, and place the whole assembly in a press heated to 170 ± 5°C. Raise the lower platen until the top
backing plate is near but not touching the upper platen. Heat transfer should be from the bottom platen up
through the sample. The upper backing plate is brought near the upper platen only to reduce heat loss. No
pressure, other than the weight of the backing plate, should be applied to the top of the sample. Allow 4
minutes for the sample to heat through and consolidate, then remove the assembly and cool on a cold surface.
Remove the backing plates and Teflon coated glass cloth. The upper surface should have deformed and
flowed noticeably over the support ring. Loosen the flash on the support ring and press the shouldered brass
ring out of the support ring. Trim the excess flash off with scissors. The upper surface of the S-1048 will
now be
.020 - .030" above the surface of the brass ring (the thickness of the molding flash). Using a very hot blade,
quickly trim it flush, preferably in a single rapid sweep. Both bottom and top surfaces of the S-1048 should
now be flush with the brass ring, and the sample should be completely consolidated and void free. Prepare
the second sample in the same way. Measure the softening point in accordance with ASTM E 28.
LOW TEMPERATURE FLEXIBILITY
Cut 3 strips, 1/4" x 6", from a length of S-1048 tape. Place the strips and a 1/4" diameter mandrel in a -55 ±
2°C cold chamber for 4 hours. While still in the chamber wrap the strips 360° around the mandrel in
approximately 2 seconds.
ADHESIVE PEEL
A)
__________________
*trademark of Du Pont
Substrates
Material
Polyethylene
Neoprene
Aluminum
Steel
Use
Thermofit RNF-100
Thermofit NT-FR
2024-T3 or equivalent
ASA-B36.10-1939
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