TBU-KE050-300-WH Bourns Inc., TBU-KE050-300-WH Datasheet - Page 5

• Manufacturer Part Number: TBU-KE050-300-WH
• Description: Single Uni-directional TBU Device
• Manufacturer: Bourns Inc.
• Series: TBU™r

Specifications of TBU-KE050-300-WH

• Voltage - Working: 250V
• Voltage - Clamping: 500V
• Technology: Mixed Technology
• Number Of Circuits: 1
• Applications: General Purpose
• Package / Case: 2-VDFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Dark grey areas show added PCB copper area for better
thermal resistance.
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
TBU
suggested layout should use Non-Solder Mask Defi ne (NSMD).
The recommended stencil thickness is 0.10-0.12 mm (.004-
.005 in.) with a stencil opening size 0.025 mm (.0010 in.) less
than the device pad size. As when heat sinking any power
device, it is recommended that wherever possible, extra PCB
copper area is allowed. For minimum parasitic capacitance, do
not allow any signal, ground or power signals beneath any of
the pads of the device.
(.098 ± .004)
2.50 ± 0.10
Product Dimensions
Recommended Pad Layout
®
TBU-KE Series - TBU
protectors have matte-tin termination fi nish. The
2
PIN 1 & BACKSIDE CHAMFER
1
(.197 ± .004)
5.00 ± 0.10
(.039)
1.00
®
High Speed Protectors
Pad #
(.033 ± .002)
Pad Designation
0.85 ± 0.05
1
2
Load Side
Line Side
(.000 - .002)
Pin Out
0.00 - 0.05
(.012)
(.012)
0.30
0.30
Thermal Resistance vs. Additional PCB Cu Area
(.012)
0.30
(.075)
1.90
(.024)
0.60
100
90
80
70
60
50
40
30
20
10
0
0
DIMENSIONS:
0.2
0.4
(.030)
(INCHES)
0.75
0.6
Added Cu Area (Sq. In.)
MM
0.8
(.120)
3.05
1.0
1.2
1.4
1.6
C
(.010)
0.25
1.8
PIN 1
2.0