ACPL-K342-500E Avago Technologies US Inc., ACPL-K342-500E Datasheet - Page 5

Plastic Optocoupler, LF+T/R

ACPL-K342-500E

Manufacturer Part Number
ACPL-K342-500E
Description
Plastic Optocoupler, LF+T/R
Manufacturer
Avago Technologies US Inc.
Series
-r
Type
Gate Driver, Miller Clampr
Datasheet

Specifications of ACPL-K342-500E

Number Of Elements
1
Input Type
DC
Output Type
Push-Pull
Forward Voltage
1.95V
Isolation Voltage
5000Vrms
Operating Temp Range
-40C to 105C
Power Dissipation
255mW
Propagation Delay Time
350ns
Pin Count
8
Mounting
Surface Mount
Reverse Breakdown Voltage
5V
Operating Temperature Classification
Industrial
Voltage - Isolation
5000Vrms
Voltage - Supply
15 V ~ 30 V
Operating Temperature
-40°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.268", 6.81mm Width)
Lead Free Status / Rohs Status
Compliant
Table 2. Insulation and Safety Related Specifications
Notes:
1. All Avago data sheets report the creepage and clearance inherent to the optocoupler component itself. These dimensions are needed as a
Table 3. Absolute Maximum Ratings
Table 4. Recommended Operating Conditions
5
Parameter
Minimum External Air Gap
(Clearance)
Minimum External Tracking
(Creepage)
Minimum Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
Parameter
Storage Temperature
Operating Temperature
Output IC Junction Temperature
Average Input Current
Peak Transient Input Current
(<1 Ps pulse width, 300pps)
Reverse Input Voltage
“High” Peak Output Current
“Low” Peak Output Current
Peak Clamp Sink Current
Total Output Supply Voltage
Input Current (Rise/Fall Time)
Output Voltage
Output IC Power Dissipation
Total Power Dissipation
Lead Solder Temperature
Parameter
Operating Temperature
Output Supply Voltage
Input Current (ON)
Input Voltage (OFF)
starting point for the equipment designer when determining the circuit insulation requirements. However, once mounted on a printed circuit
board, minimum creepage and clearance requirements must be met as specified for individual equipment standards. For creepage, the shortest
distance path along the surface of a printed circuit board between the solder fillets of the input and output leads must be considered. There are
recommended techniques such as grooves and ribs which may be used on a printed circuit board to achieve desired creepage and clearances.
Creepage and clearance distances will also change depending on factors such as pollution degree and insulation level.
Symbol
L(101)
L(102)
CTI
ACPL-H342
7.0
8.0
0.08
> 175
IIIa
Symbol
T
T
T
I
I
V
I
I
I
(V
t
V
P
P
260°C for 10 sec., 1.6 mm below seating plane
Symbol
T
(V
I
V
F(AVG)
F(TRAN)
OH(PEAK)
OL(PEAK)
CLAMP
F(ON)
r(IN)
A
J
A
S
R
O(PEAK)
O
T
F(OFF)
CC
CC
/ t
- V
- V
f(IN)
EE
EE
)
)
ACPL-K342
8.0
8.0
0.08
> 175
IIIa
Min.
-55
-40
0
-0.5
Min.
- 40
15
7
- 3.6
Units
mm
mm
mm
V
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Through insulation distance conductor to
conductor, usually the straight line distance
thickness between the emitter and detector.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Max.
125
105
125
25
1
5
2.5
2.5
2.5
35
500
V
210
255
Max.
105
30
16
0.8
CC
Units
°C
°C
°C
mA
A
V
A
A
A
V
ns
V
mW
mW
Units
°C
V
mA
V
Note
1
2
2
2
3
4
Note

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