AFCT-5745ATPZ Avago Technologies US Inc., AFCT-5745ATPZ Datasheet - Page 3

• Manufacturer Part Number: AFCT-5745ATPZ
• Description: Fiber Optic Transceiver,MODULE
• Manufacturer: Avago Technologies US Inc.
• Series: METRAKr

Specifications of AFCT-5745ATPZ

• Data Rate: 2.7Gbps
• Wavelength: 1300nm
• Applications: General Purpose
• Voltage - Supply: 3.1 V ~ 3.5 V
• Connector Type: LC Duplex
• Mounting Type: SFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Module Description
The transceiver meets the Small Form Pluggable (SFP)
industry standard package utilizing an integral LC-Duplex
optical interface connector. The hot-pluggable capabil-
ity of the SFP package allows the module to be installed
at any time - even with the host system operating and
on-line. This allows for system configuration changes or
maintenance without system down time.
Module Diagrams
Figure 1 illustrates the major functional components of
the AFCT-5745Z. The connection diagram of the mod-
ule is shown in Figure 2. Figure 3 depicts the external
configuration of the module. Figure 4 depicts the MSA
recommended power supply filter.
Figure 1. Transceiver Functional Block Diagram
Figure 2. Connection Diagram of Module Printed Circuit Board
3
LOS
RD+
RD -
TD+
TD -
Tx Disable
Tx Fault
Serial Data
Serial Clock
20
19
18
17
16
15
14
13
12
11
TOP OF BOARD
V
TD-
TD+
V
V
V
V
RD+
RD-
V
EE
EE
CC
CC
EE
EE
T
T
R
R
T
R
Memory
(AS VIEWED THROUGH TOP OF BOARD)
Current Driver
Quantizer IC
Digital Diagnostics Supervisor
Laser Diode
Analog to Digital
Optical Monitor
10
1
2
3
4
5
6
7
8
9
Conversion
BOTTOM OF BOARD
V
Tx FAULT
TxDISABLE
MOD-DEF(2)
MOD-DEF(1)
MOD-DEF(0)
RATE SELECT
LOS
V
V
EE
EE
EE
T
R
R
Supply Voltage Sensor
Temperature Sensor
Hot-Plug Control
Driver Controller
-
Laser Diode
& Pre-Amplifier
PIN Photodiode
Monitor Diode
Sub-Assembly
Laser Diode &
Sub-Assembly
-
-
Installation
The AFCT-5745Z can be installed in or removed from any
Multisource Agreement (MSA) –compliant Small Form
Pluggable port regardless of whether the host equip-
ment is operating or not. The module is simply inserted,
electrical interface first, under finger pressure. Controlled
hot-plugging is ensured by design and by 3-stage pin
sequencing at the electrical interface. The module
housing makes initial contact with the host board EMI
shield mitigating potential damage due to Electro-Static
Discharge (ESD). The 3-stage pin contact sequencing
involves (1) Ground, (2) Power, and then (3) Signal pins,
making contact with the host board surface mount con-
nector in that order.
-