HCPL-2211-560E Avago Technologies US Inc., HCPL-2211-560E Datasheet - Page 10
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HCPL-2211-560E
Manufacturer Part Number
HCPL-2211-560E
Description
Optocoupler(5MBd),T/R+IEC+LF
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-0201-500E.pdf
(18 pages)
Specifications of HCPL-2211-560E
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
25mA
Data Rate
5MBd
Propagation Delay High - Low @ If
150ns @ 3mA
Current - Dc Forward (if)
10mA
Input Type
DC
Output Type
Push-Pull, Totem-Pole
Mounting Type
Surface Mount, Gull Wing
Package / Case
8-SMD Gull Wing
Number Of Elements
1
Forward Voltage
1.7V
Forward Current
10mA
Output Current
25mA
Isolation Voltage
3750Vrms
Package Type
PDIP SMD
Operating Temp Range
-40C to 85C
Power Dissipation
210mW
Propagation Delay Time
300ns
Pin Count
8
Mounting
Surface Mount
Reverse Breakdown Voltage
5V
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HCPL-2211-560E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Recommended Operating Conditions
*The initial switching threshold is 1.6 mA or less. It is recommended that 2.2 mA be used to permit at least a 20% LED degradation guardband.
†The initial switching threshold is 1.8 mA or less. It is recommended that 2.5 mA be used to permit at least a 20% LED degradation guardband.
10
Absolute Maximum Ratings
Parameter
Power Supply Voltage
Forward Input Current (ON)
Forward Input Voltage (OFF)
Operating Temperature
Junction Temperature
Fan Out
Parameter
Storage Temperature
Operating Temperature
Average Forward Input Current
Peak Transient Input Current
Reverse Input Voltage
Average Output Current
Supply Voltage
Output Voltage
Total Package Power Dissipation
Output Power Dissipation
Lead Solder Temperature (Through Hole Parts Only)
Solder Reflow Temperature Profile
(Surface Mount Parts Only)
(≤ 1 µs Pulse Width, 300 pps)
(≤ 200 µs Pulse Width,
< 1% Duty Cycle)
HCPL-223X
HCNW22XX
HCNW22XX
HCPL-223X
HCNW22XX
Symbol
V
I
V
See Package Outline Drawings section
F(ON)
F(OFF)
T
T
N
Symbol
CC
I
260°C for 10 sec., up to seating plane
A
J
I
F(TRAN)
F(AVG)
V
P
T
T
V
V
P
I
CC
O
A
O
R
O
S
T
1.6 mm below seating plane
260°C for 10 sec.,
Min.
1.6*
1.8†
Min.
-0.5
-40
-40
-40
-55
4.5
0
-
See Figure 7
Max.
125
210
294
1.0
85
10
40
25
20
20
5
3
Max.
125
0.8
20
85
5
4
Units
mW
mA
mA
mA
°C
°C
A
V
V
V
TTL Loads
Units
mA
°C
°C
V
V
Note
1
1
1
1
1
2
1