HSMR-CL25 Avago Technologies US Inc., HSMR-CL25 Datasheet

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HSMR-CL25

Manufacturer Part Number
HSMR-CL25
Description
Chip,LF,Top Mt,InGaN,Blue
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HSMR-CL25

Color
Blue
Millicandela Rating
18mcd
Current - Test
5mA
Wavelength - Dominant
473nm
Wavelength - Peak
469nm
Voltage - Forward (vf) Typ
2.85V
Lens Type
Diffused
Lens Style/size
Rectangle, 1.1mm x 0.8mm
Package / Case
0603 (1608 Metric)
Size / Dimension
1.60mm L x 0.80mm W
Height
0.25mm
Viewing Angle
120°
Mounting Type
Surface Mount
Resistance Tolerance
473nm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Luminous Flux @ Current - Test
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HSMR-CL25
Manufacturer:
AVAGO
Quantity:
40 000
Part Number:
HSMR-CL25
Manufacturer:
AVAGO
Quantity:
50 000
HSMR-CL25
0.25mm Blue Leadframe-Based Surface Mount ChipLED
Data Sheet
Description
The HSMR-CL25 series of parts is designed with an ultra
small form factor to allow this miniaturization. The HSMR-
CL25 series is the thinnest available top emitting package
in the market with high brightness InGaN die technology.
The leadframe construction of this package allows the
part to transfer heat from the package, thus it is able to
survive temperature conditions of -40°C to 85°C despite
its small size.
The target applications are Keypad backlighting, Push
button backlighting and Status indicators.
The target markets are Mobile Handsets, Communications,
Office
automations, Home Market appliances, Networking,
Medical Instruments, and Mobile Computing. This product
is competitively priced, and production is geared towards
short lead times and ample capacity.
Package Dimensions

LED DIE
CAUTION: HSMR-CL25 LEDs are Class 1B ESD sensitive per JESD22-A114C.01. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Automation,
0.4
TERMINAL VIEW
TOP VIEW
1.6
Industrial
CATHODE SIDE
and
0.8
Commercial
RESIN
LEADFRAME
Features
• Small size top firing
• Small .6 (L) x 0.8 (W) x 0.25 (H) mm package
• Compatible with IR Reflow
• High brightness using InGaN die technology
• Available in 8mm Tape on 7” (78 mm) Diameter Reels
Advantages
• High package thermal dissipation capability due to the
• Small footprint to overcome space count
• Low thickness to overcome space constrains
• Short lead times and competitive pricing
Notes:
. All dimensions are in millimeters.
2. Tolerance is ±0.mm unless otherwise specified.
superior package leadframe design
SIDE VIEW
1.1
0.25 ± 0.05

Related parts for HSMR-CL25

HSMR-CL25 Summary of contents

Page 1

... LED DIE TOP VIEW CATHODE SIDE 0.4 TERMINAL VIEW CAUTION: HSMR-CL25 LEDs are Class 1B ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.  Features • Small size top firing • Small .6 (L) x 0.8 (W) x 0.25 (H) mm package • ...

Page 2

... Optical Characteristics 25°C Luminous Intensity IV @ 5mA Part Number Min. HSMR-CL25 .2 Notes: . The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. ...

Page 3

Light Intensity (IV) Bin Limits Intensity (mcd) Bin ID Minimum L .20 M 8.00 N 28.50 Tolerance : ±5% Forward Voltage (VF) Bin Limits Forward Voltage (V) Bin ID Minimum  2.55 2 2.75 3 2.95 Tolerance : ±0.V 100 ...

Page 4

ANGULAR DISPLACEMENT - DEGREES Figure 5. Radiation Pattern 0.8 (0.031) 0.8 0.8 (0.031) (0.031) 0.7 (0.028) Notes: . All dimensions are in millimeters (inches). 2. ...

Page 5

USER FEED DIRECTION PRINTED LABEL Figure 9. Reeling orientation. 3.0 ± 0.5 (0.118 ± 0.020) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Notes: . All dimensions are in millimeters (inches). 2. Tolerance is ±0.mm (±0.004in.) ...

Page 6

... PART NUMBER DIM. A HSMR-CL25 1.75 (0.069) 0.88 (0.035) ± 0.10 (0.004) ± 0.10 (0.004) Figure 11. Tape Dimensions END THERE SHALL BE A MOUNTED WITH MINIMUM OF 160 mm COMPONENTS (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 12. Tape leader and trailer dimensions. ...

Page 7

Reflow Soldering: For more information on reflow soldering, refer to Application Note AN-060, Surface Mounting SMT LED Indicator Components. For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A ...

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