262-75ABE-05 Wakefield Thermal Solutions, 262-75ABE-05 Datasheet - Page 10

• Manufacturer Part Number: 262-75ABE-05
• Description: Board Level Heat Sinks For TO-220 & TO-218 & Multiwatt Components
• Manufacturer: Wakefield Thermal Solutions
• Series: 262r

Specifications of 262-75ABE-05

• Package Cooled: TO-220
• Attachment Method: Press Fit and PC Pin
• Outline: 14.48mm x 12.70mm
• Height: 0.750" (19.05mm)
• Power Dissipation @ Temperature Rise: 3W @ 80°C
• Thermal Resistance @ Forced Air Flow: 10.0°C/W @ 200 LFM
• Thermal Resistance @ Natural: 26.7°C/W
• Product: Heatsinks
• Mounting Style: Through Hole
• Heatsink Material: Aluminum
• Dimensions: 12.7 mm L x 14.5 mm W x 19.1 mm H
• Designed For: TO-220
• Color: Black
• Thermal Resistance: 10°C/W
• Width: 14.5mm
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 262-75AB-05; 26275AB05; 345-1085

WTS001_p26-49
BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND M
Dimensions: in. (mm)
Dimensions: in. (mm)
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
6/14/07
10:55 AM
Standard
P/N
244-145AB
244-145ABE-50 1.650 (41.9)
Material: Aluminum, Black Anodized
Standard
P/N
245-145AB
245-145ABE-50 1.650 (41.9)
Material: Aluminum, Black Anodized
Standard
P/N
246-197AB
246-197ABE-50 2.168 (55.1)
Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section).
Material: Aluminum, Black Anodized
244 SERIES
245 SERIES
246 SERIES
Page 31
Height Above
Height Above
Height Above
1.450 (36.8)
1.450 (36.8)
1.968 (50.0)
PC Board
in. (mm)
PC Board
in. (mm)
PC Board
in. (mm)
Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks
Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks
Medium Height, Slim Profile Wavesolderable Folded Fin Heat Sinks
1.300 (33.0) x 480 (12.1)
1.300 (33.0) x 480 (12.1)
1.750 (44.5) x .380 (9.7)
1.750 (44.5) x .380 (9.7)
1.986 (50.4) x 3.75 (9.5)
1.986 (50.4) x 3.75 (9.5)
Dimensions
Dimensions
Dimensions
Footprint
Footprint
Footprint
in. (mm)
in. (mm)
in. (mm)
Configuration
Configuration
Configuration
Ver.t/Horiz.
Vert./Horiz.
Vert/Horiz,
Mounting
Mounting
Mounting
Vertical
Vertical
Vertical
Tab Options
Tab Options
Tab Options
Solderable
Solderable
Solderable
No Tab
No Tab
No Tab
50
50
50
ULTIWATT
Thermal Performance at Typical Load
Thermal Performance at Typical Load
Thermal Performance at Typical Load
44°C @ 4W
44°C @ 4W
38°C @ 4W
38°C @ 4W
35°C @ 4W
35°C @ 4W
Convection
Convection
Convection
Natural
Natural
Natural
™ COMPONENTS
4.4°C/W @ 400 LFM
4.4°C/W @ 400 LFM
3.2°C/W @ 400 LFM
3.2°C/W @ 400 LFM
2.8°C/W @ 400 LFM
2.8°C/W @ 400 LFM
Convection
Convection
Convection
Forced
Forced
Forced
Board Level
Heat Sinks
MULTIWATT
MULTIWATT
MULTIWATT
.0240 (10.90)
.0250 (11.40)
lbs. (grams)
.0160 (7.25)
.0170 (7.20)
lbs. (grams)
.0160 (7.25)
.0170 (7.20)
lbs. (grams)
Weight
Weight
Weight
31