262-75ABE-05 Wakefield Thermal Solutions, 262-75ABE-05 Datasheet - Page 18

• Manufacturer Part Number: 262-75ABE-05
• Description: Board Level Heat Sinks For TO-220 & TO-218 & Multiwatt Components
• Manufacturer: Wakefield Thermal Solutions
• Series: 262r

Specifications of 262-75ABE-05

• Package Cooled: TO-220
• Attachment Method: Press Fit and PC Pin
• Outline: 14.48mm x 12.70mm
• Height: 0.750" (19.05mm)
• Power Dissipation @ Temperature Rise: 3W @ 80°C
• Thermal Resistance @ Forced Air Flow: 10.0°C/W @ 200 LFM
• Thermal Resistance @ Natural: 26.7°C/W
• Product: Heatsinks
• Mounting Style: Through Hole
• Heatsink Material: Aluminum
• Dimensions: 12.7 mm L x 14.5 mm W x 19.1 mm H
• Designed For: TO-220
• Color: Black
• Thermal Resistance: 10°C/W
• Width: 14.5mm
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 262-75AB-05; 26275AB05; 345-1085

WTS001_p26-49
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
These slim profile unidirectional fin heat sinks offer users two assembly alternatives for verti-
cally mounting TO-220 and TO-218 components. Models are available with or without wave-
Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maxi-
mum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight and
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
Dimensions: in. (mm)
Notes:
1. Thermal compound is as-
2. Tab temp with longer heat
sumed between device
and heat sink.
sink (634-20ABP) will
typically be about 15%
cooler. Tab temp with
shorter heat sink
(634- I0ABP) will typically
be about 25% higher.
6/14/07
10:56 AM
Material: Aluminum, Black Anodized.
Standard
P/N
637-10ABEP
637-15ABEP
637-20ABEP
637-25ABEP
Material: Aluminum, Black Anodized
634 SERIES
637 SERIES
634-10ABEP
634-15ABEP
634-20ABEP
Plain Pin
Page 39
Standard
P/N
PC Board “A”
Slim Profile Unidirectional Fin Vertical Mount Heat Sink
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
2.500 (63.5)
High-Efficiency Heat Sinks For Vertical Board Mounting
Height Above
in. (mm)
Without Pin
634-10AB
634-15AB
634-20AB
(EXTRUSION PROFILE 5183)
634 SERIES
637 SERIES
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
1.375 (34.9) x 0.500 (12.7)
Maximum Footprint
in. (mm)
Height Above
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
PC Board
in. (mm)
solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications
where quick assembly is needed and space is at a premium.
board space occupied must be minimized. Refer to the Accessory products section for thermal
interface materials, thermal compounds, and other accessories products.
0.640 (16.26) x 0.640 (16.26)
0.640 (16.26) x 0.640 (16.26)
0.640 (16.26) x 0.640 (16.26)
76°C @ 6W
55°C @ 6W
48°C @ 6W
Thermal Performance at Typical Load
Convection
65°C @ 6w
Natural
TYPICAL THERMAL PERFORMANCE
Dimensions
Footprint
in. (mm)
FOR 634-15ABP
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
5.8°C/W @ 200 LFM
5.5°C/W @ 200 LFM
4.7°C/W @ 200 LFM
4.2°C/W @ 200 LFM
Convection
Forced
0.025 (11.21)
0.033 (14.95)
lbs. (grams)
0.016 (7.48
Board Level
TO-220 and TO-218
Weight
Heat Sinks
0.023 (10.43)
0.035 (15.88)
0.050 (22.68)
0.062 (28.12)
lbs. (grams)
Weight
TO-220
39