657-20ABPN Wakefield Thermal Solutions, 657-20ABPN Datasheet - Page 12

• Manufacturer Part Number: 657-20ABPN
• Description: Heat Sink
• Manufacturer: Wakefield Thermal Solutions

Specifications of 657-20ABPN

• Packages Cooled: TO-218 / TO-220 / TO-247
• Thermal Resistance: 32°C/W
• Width: 41.9mm
• Height: 50.8mm
• Heat Sink Material: Aluminum
• Peak Reflow Compatible (260 C): No
• Length: 25.4mm
• Leaded Process Compatible: No
• Product: Heatsinks
• Mounting Style: Through Hole
• Heatsink Material: Aluminum
• Dimensions: 25.4 mm L x 41.9 mm W x 50.8 mm H
• Designed For: TO-220, TO-247, TO-218
• Color: Black
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into pre-
drilled circuit boards; scored mounting tabs may be bent after insertion to provide added stabili-
Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed circuit boards.
Soldered, pre-tinned tabs can be wavesoldered directly to the board. A 0.375 in. (9.5 mm)
Dimensions: in. (mm)
Dimensions: in. (mm)
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
MECHANICAL
DIMENSIONS
Normally stocked
286 SERIES
Standard
P/N
286-AB
286-CBT
286-CT
287 SERIES
Mounting Slot
287-1AB
287-2AB
Material: Aluminum, Black Anodized
695 SERIES
Standard
P/N
695-1B
Mount and effectively heat sink small stud-mounted diodes with the 695 Series
space-saving heat sink type. Each unit is black anodized aluminum with an
0.200 in. (5.1) dia. mounting hole centered in the base. The folded fin design
Standard P/N
Height Above
1.190 (30.2)
1.190 (30.2)
1.190 (30.2)
PC Board
in. (mm)
Mounting Hole
Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks
Wave-Solderable Low-Cost Heat Sinks
Space-Saving Heat Sinks for Small Stud-Mounted Diodes
287-1ABH
287-2ABH
1.330 (33.8)
Maximum
in. (mm)
Width
1.000 (25.4) x 0.500 (12.7)
1.000 (25.4) x 0.500 (12.7)
1.000 (25.4) x 0.500 (12.7)
Maximum Footprint
Height Above
1.180 (30.0)
1.180 (30.0)
in. (mm)
PC Board
in. (mm)
0.530 (13.7)
695 SERIES
in. (mm)
Height
286 SERIES
1.000 (25.4) x 0.500 (12.7)
1.000 (25.4) x 1.000 (25.4)
41
Aluminum, Anodized
Footprint “A”
Copper, Tinned
t y. The 286 Series can be wavesoldered directly to the board. Material: 286-AB style (aluminum,
Maximum
black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned).
mounting slot allows for correct positioning of TO-220 and similar semiconductor packages.
Copper, Black
in. (mm)
287 SERIES
Material
Standard P/N
287-1AB
287-2AB
287-1ABH
287-2ABH
72°C @ 4.0W
Convection
Thermal Performance at Typical Load
Natural
provides good heat dissipation for use where height is limited above the print-
ed circuit board or base plate.
0.500 (12.7)
1.000 (25.4)
0.500 (12.7)
1.000 (25.4)
All other products, please contact factory for price, delivery, and minimums.
Dim. “A”
58°C @ 4W
58°C @ 4W
58°C @ 4W
Convection
Thermal Performance at Typical Load
Natural
Thermal Performance at Typical Load
55°10 @ 4W
65°C @ 4W
Convection
Natural
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
5.2°C/W @ 400 LFM
NATURAL AND FORCED
NATURAL AND FORCED
NATURAL AND FORCED
Convection
7.4°CW @ 200 LFM
7.4°CW @ 200 LFM
7.4°CW @ 200 LFM
Forced
7.8°CW @ 200 LFM
6.4°CW @ 200 LFM
Convection
Convection
Forced
Forced
Board Level
Heat Sinks
0.0250 (11.34)
0.0250 (11.34)
0.0090 (4.08)
0.0140 (6.35)
0.0085 (3.86)
lbs. (grams)
STUD-MOUNT
lbs. (grams)
0.0030 (1.36)
Weight
lbs. (grams)
TO-220
Weight
TO-220
Weight