657-20ABPN Wakefield Thermal Solutions, 657-20ABPN Datasheet - Page 13

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657-20ABPN

Manufacturer Part Number
657-20ABPN
Description
Heat Sink
Manufacturer
Wakefield Thermal Solutions
Datasheet

Specifications of 657-20ABPN

Packages Cooled
TO-218 / TO-220 / TO-247
Thermal Resistance
32°C/W
Width
41.9mm
Height
50.8mm
Heat Sink Material
Aluminum
Peak Reflow Compatible (260 C)
No
Length
25.4mm
Leaded Process Compatible
No
Product
Heatsinks
Mounting Style
Through Hole
Heatsink Material
Aluminum
Dimensions
25.4 mm L x 41.9 mm W x 50.8 mm H
Designed For
TO-220, TO-247, TO-218
Color
Black
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
260 SERIES
Materials and Finish: Cups – beryllium copper, black ebonol “C”; Bases – brass, black ebonol “C”; Ceramic Spacers – beryllium oxide
Base Mounting Configurations — TO-5
Plain Ty p e — Epoxy bonded, or used with #4 pan head screws.
Tapped Base — #4-40 UNC screw (not supplied) fits tapped hole. Care
should be taken not to use too long a screw, which could short against the
semiconductor case. For correct screw lengths:
Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness
Stud Mounting Base. #6-32 UNC or #10-32 UNF studs. Nuts and washers not
supplied. Stud hole must be slightly countersunk to ensure flat mounting.
Epoxy Insulated For TO-5
All other products, please contact factory for price, delivery, and minimums.
Thermal Resistance – Epoxy Insulated
Thermal Resistance – Beryllium Oxide Insulated
260-6SH5E
Characteristics
Breakdown Voltage – Epoxy Type (VAC), 60 Hz
Breakdown Voltage – Beryllium Type (VAC), 60 Hz
Recommended Operating Voltage, AC or DC
Temperature Range — Continuous (C°)
TO-5 CASE STYLE CUP CLIPS — ORDERING GUIDE
Standard
P/N
260-4T5E
260-4TH5E
260-1OSH5E
260-4TH5B
260-6SH5B
260-10SH5B
Board Level
Heat Sinks
Clean Conditions: % Hipot Rating
Dusty Conditions: % Hipot Rating
Dirty Conditions: % Hipot Rating
260-4T5E
Cup Clips for TO-5 Case Style Semiconductors
Beryllium Oxide Insulated
Beryllium Oxide Insulated
Beryllium Oxide Insulated
Epoxy Insulated
Epoxy Insulatad
Epoxy Insulated
Epoxy Insulated
P/N
256 SERIES
Standard
256-DM
Insulation
Type
Thermal Retainers
260-4TH5E
Mounting Tab)
Height (Less
0.190 (4.0)
in. (mm)
0.400 (10.2) x 0.370 (9.4) hex. x 0.290 (7.4)
0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4)
0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4)
0.445 (11.3) x 0.370 (9.4) hex. x 0.290 (7.4)
0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4)
0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4)
0.370 (9.4) x 0.380 (9.7) dia. x 0.290 (7.4)
-73/+149
16° C/W
10 to 20
14° C/W
TO-5
1000
500
50
30
Outline Dimension
L x W x I.D.
T h r e a d
S i z e :
M o u n t i n g
S t y l e :
in. (mm)
Model
260-4T5E
260-4TH5E
260-4TH5B
Beryllium Copper
Material
10 = #10-32 UNF
4 = #4-40 UNC
6 = #6-32 UNC
T = t a p p e d
S = s t u d
P = p l a i n
260-10SH5E
260-6SH5E
Tapped Base
0.093 (2.36)
0.125 (3.18)
0.125 (3.18)
Depth of
42
0.0005 (0.23)
lbs. (grams)
To determine the correct mounting screw lengths, add dimensions as follows:
Correct Screw Length (L) =
0.0024 (1.09)
0.0042 (1.91)
0.0039 (1.77)
0.0043 (1.95)
0.0031 (1.41)
0.0037 (1.68)
0.0042 (1.91)
Weight
lbs. (grams)
S e m i c o n d u c t o r
Weight
Beryllium Oxide Insulated For TO-5
Base Style: H = h e x
Case Style: 5 = T O - 5
I n s u l a t i o n E = e p o x y
Ty p e : B = b e ry l l i u m
Case
Style
TO-5
TO-5
TO-5
TO-5
TO-5
TO-5
TO-5
260-4TH5B
Depth of Base + Panel Thickness + Washer Thickness
256-DM
260-10SH5B
260-6SH5B
Normally stocked
TO-92
TO-5

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