624-25ABT4E Wakefield Thermal Solutions, 624-25ABT4E Datasheet - Page 7

• Manufacturer Part Number: 624-25ABT4E
• Description: 624-25ABT4E
• Manufacturer: Wakefield Thermal Solutions
• Series: 624r

Specifications of 624-25ABT4E

• Rohs Compliant: NO
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Included)
• Outline: 21.00mm x 21.00mm
• Height: 0.250" (6.35mm)
• Thermal Resistance @ Forced Air Flow: 20°C/W @ 350 LFM
• Product: Heatsinks
• Mounting Style: Panel
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 27.94 mm L x 27.94 mm W x 11.43 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA
• Color: Black
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation @ Temperature Rise: -
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1098; 624-25ABT4E; Q2754270

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
2. Optional factory preapplied pressure-sensitive adhesive. See Page 3
PRODUCT FEATURES
919541 Series Heat Sink Thermal Performance
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9
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1
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Approach Air Velocity, LFM
Performance shown is with S5 interface material applied.