AD9276-80KITZ Analog Devices Inc, AD9276-80KITZ Datasheet - Page 10
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AD9276-80KITZ
Manufacturer Part Number
AD9276-80KITZ
Description
80MSPS ADC Converter Evaluation Board
Manufacturer
Analog Devices Inc
Datasheet
1.AD9276BSVZ.pdf
(48 pages)
Specifications of AD9276-80KITZ
Silicon Manufacturer
Analog Devices
Application Sub Type
ADC
Kit Application Type
Data Converter
Silicon Core Number
AD9276
Number Of Adc's
1
Number Of Bits
12
Sampling Rate (per Second)
80M
Data Interface
Serial, SPI™
Inputs Per Adc
1 Differential
Input Range
*
Power (typ) @ Conditions
195mW @ 40MSPS
Voltage Supply Source
Analog and Digital
Operating Temperature
-40°C ~ 85°C
Utilized Ic / Part
AD9276
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
AD9276
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
AVDD1 to GND
AVDD2 to GND
DRVDD to GND
GND to GND
AVDD2 to AVDD1
AVDD1 to DRVDD
AVDD2 to DRVDD
Digital Outputs (DOUTx+, DOUTx−,
CLK+, CLK−, SDIO to GND
LI-x, LO-x, LOSW-x to GND
CWI−, CWI+, CWQ−, CWQ+ to GND
PDWN, STBY, SCLK, CSB to GND
GAIN+, GAIN−, RESET, 4LO+, 4LO−,
RBIAS, VREF to GND
Operating Temperature Range (Ambient)
Storage Temperature Range (Ambient)
Maximum Junction Temperature
Lead Temperature (Soldering, 10 sec)
DCO+, DCO−, FCO+, FCO−) to GND
GPO0, GPO1, GPO2, GPO3 to GND
Rating
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−2.0 V to +3.9 V
−2.0 V to +2.0 V
−2.0 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−40°C to +85°C
−65°C to +150°C
150°C
300°C
Rev. 0 | Page 10 of 48
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL IMPEDANCE
Table 5.
Airflow Velocity (m/s)
0.0
1.0
2.5
1
ESD CAUTION
θ
soldered to PCB.
JA
for a 4-layer PCB with solid ground plane (simulated). Exposed pad
θ
20.3
14.4
12.9
JA
1
θ
7.6
JB
θ
4.7
JC
Unit
°C/W
°C/W
°C/W