BMP085-0330SBO008 BOSCH, BMP085-0330SBO008 Datasheet - Page 15

• Manufacturer Part Number: BMP085-0330SBO008
• Description: Daughter Board
• Manufacturer: BOSCH

Specifications of BMP085-0330SBO008

• Silicon Manufacturer: Bosch
• Application Sub Type: Accelerometer - Three-Axis
• Kit Application Type: Sensing - Motion / Vibration / Shock
• Silicon Core Number: BMP085
• Kit Contents: Board

BMP085
Bosch Sensortec
Data sheet
4.2 Device and register address
The BMP085 module address is shown below. The LSB of the device address distinguishes
between read (1) and write (0) operation, corresponding to address 0xEF (read) and 0xEE
(write).
A7
A6
A5
A4
A3
A2
A1
W/R
1
1
1
0
1
1
1
0/1
2
4.3 I
C protocol
2
The I
C interface protocol has special bus signal conditions. Start (S), stop (P) and binary data
conditions are shown below. At start condition, SCL is high and SDA has a falling edge. Then
the slave address is sent. After the 7 address bits, the direction control bit R/W selects the read
or write operation. When a slave device recognizes that it is being addressed, it should
acknowledge by pulling SDA low in the ninth SCL (ACK) cycle.
At stop condition, SCL is also high, but SDA has a rising edge. Data must be held stable at SDA
when SCL is high. Data can change value at SDA only when SCL is low.
Rev. 1.0
Page 15
01 July 2008
© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such
as copying and passing on to third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.
Specifications are subject to change without notice.