JN5148/001,518 NXP Semiconductors, JN5148/001,518 Datasheet - Page 96

• Manufacturer Part Number: JN5148/001,518
• Description: MCU 802.15.4 32BIT 2.4G 56-QFN
• Manufacturer: NXP Semiconductors
• Series: JN5148r

Specifications of JN5148/001,518

• Frequency: 2.4GHz
• Data Rate - Maximum: 667kbps
• Modulation Or Protocol: 802.15.4
• Applications: Home/Building Automation, Industrial Control
• Power - Output: 2.5dBm
• Sensitivity: -95dBm
• Voltage - Supply: 2 V ~ 3.6 V
• Current - Receiving: 17.5mA
• Current - Transmitting: 15mA
• Data Interface: PCB, Surface Mount
• Memory Size: 128kB RAM, 128kB ROM
• Antenna Connector: PCB, Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 56-VFQFN
• Core: RISC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

B.4.2 PCB Design and Reflow Profile
PCB and land pattern designs are key to the reliability of any electronic circuit design.
The Institute for Interconnecting and Packaging Electronic Circuits (IPC) defines a number of standards for electronic
devices. One of these is the "Surface Mount Design and Land Pattern Standard" IPC-SM-782 [3], commonly referred
to as “IPC782". This specification defines the physical packaging characteristics and land patterns for a range of
surface mounted devices. IPC782 is also a useful reference document for general surface mount design techniques,
containing sections on design requirements, reliability and testability. Jennic strongly recommends that this be
referred to when designing the PCB.
The suggested reflow profile is shown in Figure 60. The specific paste manufacturers guidelines on peak flow
temperature, soak times, time above liquidus and ramp rates should also be referenced.
Figure 60: Recommended Reflow Profile for Lead-free Solder Paste or PPF lead frame
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JN-DS-JN5148-001 1v6
© NXP Laboratories UK 2010