B32924C3684K EPCOS Inc, B32924C3684K Datasheet - Page 10

• Manufacturer Part Number: B32924C3684K
• Description: Film Cap 0,68UF 10% 305V MKP X2
• Manufacturer: EPCOS Inc
• Series: MKP B32924r

Specifications of B32924C3684K

• Capacitance: 0.68µF
• Voltage - Ac: 305V
• Voltage - Dc: 630V
• Dielectric Material: Polypropylene, Metallized
• Tolerance: ±10%
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: Radial
• Size / Dimension: 1.240" L x 0.433" W (31.50mm x 11.00mm)
• Height: 0.748" (19.00mm)
• Termination: PC Pins
• Lead Spacing: 1.083" (27.50mm)
• Features: EMI Suppression
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Esr (equivalent Series Resistance): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 495-4212

1.3
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Uncoated capacitors
For uncoated MKT capacitors with lead spacings 10 mm (B32560/B32561) the following mea-
sures are recommended:
Please read Cautions and warnings and
Important notes at the end of this document.
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
Pre-heating with a maximum temperature of 110 C
Temperature inside the capacitor should not exceed the following limits:
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
pre-heating to not more than 110 C in the preheater phase
rapid cooling after soldering
MKP/MFP 110 C
MKT 160 C
General notes on soldering
B32921C/D ... B32926C/D
X2 / 305 V AC
max
. Long exposure to temperatures above this type-related temperature limit
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