B32924C3684K EPCOS Inc, B32924C3684K Datasheet - Page 12

Film Cap 0,68UF 10% 305V MKP X2

B32924C3684K

Manufacturer Part Number
B32924C3684K
Description
Film Cap 0,68UF 10% 305V MKP X2
Manufacturer
EPCOS Inc
Series
MKP B32924r
Datasheet

Specifications of B32924C3684K

Capacitance
0.68µF
Voltage - Ac
305V
Voltage - Dc
630V
Dielectric Material
Polypropylene, Metallized
Tolerance
±10%
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Package / Case
Radial
Size / Dimension
1.240" L x 0.433" W (31.50mm x 11.00mm)
Height
0.748" (19.00mm)
Termination
PC Pins
Lead Spacing
1.083" (27.50mm)
Features
EMI Suppression
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Esr (equivalent Series Resistance)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
495-4212

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
B32924C3684K000
Manufacturer:
SILONEX
Quantity:
201
Part Number:
B32924C3684K189
Manufacturer:
TDK-EPCOS
Quantity:
460 000
Part Number:
B32924C3684K289
Manufacturer:
TDK-EPCOS
Quantity:
460 000
3
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Important notes at the end of this document.
Embedding of capacitors in finished assemblies
B32921C/D ... B32926C/D
X2 / 305 V AC
Page 12 of 18

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