PCA9552D NXP Semiconductors, PCA9552D Datasheet - Page 25

• Manufacturer Part Number: PCA9552D
• Description: LED Drivers I2C LED BLINKR 16BIT
• Manufacturer: NXP Semiconductors

Specifications of PCA9552D

• Number Of Segments: 16
• Low Level Output Current: 25000 uA (Min)
• Operating Supply Voltage: 2.3 V to 5.5 V
• Maximum Supply Current: 550 uA
• Maximum Power Dissipation: 400 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: SOT-137
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: PCA9552D,112

Philips Semiconductors
16. Abbreviations
PCA9552_5
Product data sheet
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
Table 16:
Acronym
CDM
DSP
ESD
HBM
GPIO
IC
I
LED
MCU
MM
MPU
POR
PWM
SMBus
2
C-bus
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods .
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 C
body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Abbreviations
Description
Charged Device Model
Digital Signal Processor
ElectroStatic Discharge
Human Body Model
General Purpose Input/Output
Integrated Circuit
Inter IC bus
Light Emitting Diode
Microcontroller
Machine Model
Microprocessor
Power-On Reset
Pulse Width Modulation
System Management Bus
Rev. 05 — 9 March 2006
16-bit I
10 C measured in the atmosphere of the reflow oven. The package
2
C-bus LED driver with programmable blink rates
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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