HA7210IBZ Intersil, HA7210IBZ Datasheet - Page 3

• Manufacturer Part Number: HA7210IBZ
• Manufacturer: Intersil

Specifications of HA7210IBZ

• Output Level: CMOS
• Symmetry Max: 60%
• Operating Supply Voltage (typ): 5
• Pin Count: 8
• Mounting Style: Surface Mount
• Screening Level: Industrial
• Product Height (mm): 1.5mm
• Product Depth (mm): 4mm
• Product Length (mm): 5mm
• Rad Hardened: No
• Package / Case: SOIC N
• Lead Free Status / RoHS Status: Compliant

Absolute Maximum Ratings
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10V
Voltage (Any Pin) . . . . . . . . . . . . . . . . . . . . V
ESD Rating
Operating Conditions
Temperature Range (Note 3). . . . . . . . . . . . . . . . . . . -40
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
Electrical Specifications
NOTES:
V
I
V
V
I
I
Three-State Leakage Current
I
V
V
Enable Time
Disable Time
t
t
Duty Cycle, Packaged Part Only (Note 6)
Duty Cycle, (See Typical Curves)
Frequency Stability vs Supply Voltage
Frequency Stability vs Temperature
Frequency Stability vs Load
3. This product is production tested at 25
4. θ
5. Calculated using the equation I
6. Duty cycle will vary with supply voltage, oscillation frequency, and parasitic capacitance on the crystal pins.
DD
OH
OL
IN
r
f
Human Body Model (Per MIL-STD-883 Method 3015.7) . . .4000V
OH
DD
OL
IH
IL
Output Fall Time
Output Rise Time
Enable, Freq1, Freq2 Input Current
Input Low Voltage Enable, Freq1, Freq2
Output Low Current
Input High Voltage Enable, Freq1, Freq2
Supply Current
Output High Current
JA
Output High Voltage
Output Low Voltage
Supply Range
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
PARAMETER
3
DD
V
SS
= I
= GND, T
DD
o
C only.
SS
(No Load) + (V
f
f
f
EN = 1, Freq1 = 1, Freq2 = 1
f
Freq1 = 1, Freq2 = 1
f
EN = 1, Freq1 = 0, Freq2 = 1
f
Freq1 = 0, Freq2 = 1
I
I
V
V
V
V
V
C
C
10% - 90%, f
10% - 90%, f
C
C
f
f
f
OSC
OSC
OSC
OSC
OSC
OSC
OUT
OUT
OSC
OSC
OSC
-0.3V to V
OUT
OUT
OUT
OUT
IN
L
L
L
L
A
= 40pF, f
= 18pF, R
= 18pF, R
= 40pF, f
= V
= 25
= -1mA
= 1mA
= 32kHz
= 32kHz, EN = 0 (Standby)
= 32kHz, C
= 32kHz, C
= 1MHz, C
= 1MHz, C
= 32kHz, V
= 32kHz, V
= 32kHz, V
≥ 4V
≤ 0.4V
= 0V, 5V, T
= 0V, 5V, T
SS
TEST CONDITIONS
o
o
C, Unless Otherwise Specified
C to 85
DD
to V
OSC
OSC
OSC
DD
OSC
L
L
+0.3V
DD
= 1kΩ
= 1kΩ
) (f
L
L
= 1MHz
DD
DD
DD
L
L
= 32kHz, C
= 32kHz, C
= 32kHz
o
A
A
= 10pF (Note 5),
= 40pF, EN = 1,
OSC
= 10pF (Note 5),
= 40pF, EN = 1,
C
HA7210
= 25
= 85
= 5V, C
= 5V, C
= 5V, C
)(C
o
o
C, -40
C
L
)
L
L
L
L
L
= 40pF
= 10pF
= 10pF
= 10pF
= 40pF
Thermal Information
Thermal Resistance (Typical, Note 4)
Maximum Junction Temperature (Plastic Package) . . . . . . . .150
Maximum Storage Temperature Range . . . . . . . . . -65
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
o
C
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(SOIC - Lead Tips Only)
MIN
4.0
5.0
2.0
40
2
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
V
DD
TYP
0.07
10.0
0.01
130
270
800
-10
5.0
5.2
4.9
0.1
0.4
0.1
10
10
90
12
12
54
41
5
1
-
-
= 5V
MAX
10.2
200
350
9.0
0.4
1.0
0.8
15
25
25
60
-5
7
-
-
-
-
-
-
-
-
-
-
-
MIN
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
V
DD
TYP
180
3.6
6.5
2.8
0.1
90
12
14
44
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
= 3V
MAX
180
270
6.1
9
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
o
θ
C to 150
JA
ppm/
ppm/pF
UNITS
ppm/V
120
165
(
mA
mA
o
µA
µA
µA
µA
µA
nA
nA
µA
ns
ns
ns
ns
%
%
V
V
V
V
V
C/W)
o
o
o
o
C
C
C
C