ECLAMP2356C.WCT Semtech, ECLAMP2356C.WCT Datasheet

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ECLAMP2356C.WCT

Manufacturer Part Number
ECLAMP2356C.WCT
Description
Manufacturer
Semtech
Datasheet

Specifications of ECLAMP2356C.WCT

Attenuation (max)
20dB
Mounting Style
Surface Mount
Termination
Flat Style
Operating Temp Range
-40C to 85C
Lead Free Status / RoHS Status
Compliant
The EClamp
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solid-
state silicon-avalanche technology for superior clamp-
ing performance and DC electrical characteristics.
They have been optimized for protection of color
LCD panels
LCD panels
LCD panels in cellular phones and other portable
electronics.
The device consists of ten identical circuits comprised
of TVS diodes for ESD protection, and a resistor -
capacitor network for EMI/RFI filtering. A series
resistor value of 100
12pF is used to achieve 20dB minimum attenuation
from 800MHz to 3GHz. Each line features two stages
of TVS diode protection. The TVS diodes provide
effective suppression of ESD voltages in excess of
15kV (air discharge) and 8kV (contact discharge) per
IEC 61000-4-2, level 4.
The device is a 25-bump, 0.5mm pitch flip chip array
with a 5x5 bump grid. It measures 2.6 x 2.6 x
0.65mm. The solder bumps have a nominal diameter
of 0.315mm.
Revision 02/14/2006
LCD panels
LCD panels
PROTECTION PRODUCTS
PROTECTION PRODUCTS - EMIClamp
Description
Circuit Diagram
IN
TM
2356C is a low pass filter array with
6pF
Circuit 10x
100
and a capacitance value of
GND
6pF
protection of color
protection of color
protection of color
protection of color
OUT
TM
1
Features
Mechanical Characteristics
Applications
PIN Configuration
Flip Chip bidirectional EMI/RFI filter with
integrated ESD protection
ESD protection to IEC 61000-4-2 (ESD) Level4,
±15kV (air), ±8kV (contact)
Filter performance: 20dB minimum attenuation
800MHz to 3GHz
TVS working voltage: 5V
Resistor: 100 Ohms
Input Capacitance:12.5pF
Protection and filtering for ten lines
Solid-state technology
JEDEC MO-211, Variation BF, 0.5 mm pitch flip chip
Nominal Dimensions: 2.6 x 2.6 x 0.65 mm
Bump Diameter: 315 ±20 m
Non-conductive top side coating
Marking : Mark code, lot code, orientation mark
Packaging : Tape and Reel per EIA 481
RoHS/WEEE Compliant
Color LCD Panel Protection
Cell Phone CCD Camera Lines
Personal Digital Assistants (PDA’s)
EMI Filter and ESD Protection
5 x 5 Grid Flip Chip (Ball Side View)
for Color LCD Interfaces
12.5pF
12.5pF
12.5pF
12.5pF ±20%
EClamp2356C
20%
20%
20%
20% (VR = 0V)
PRELIMINARY
www.semtech.com

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ECLAMP2356C.WCT Summary of contents

Page 1

... Packaging : Tape and Reel per EIA 481 RoHS/WEEE Compliant Applications Color LCD Panel Protection Cell Phone CCD Camera Lines Personal Digital Assistants (PDA’s) PIN Configuration OUT Grid Flip Chip (Ball Side View) 1 EClamp2356C PRELIMINARY 12.5pF 12.5pF ±20% 12.5pF 20% 20% 20% (VR = 0V) 12.5pF 20% www.semtech.com ...

Page 2

... PROTECTION PRODUCTS - EMIClamp Absolute Maximum Rating Electrical Characteristics (T= 2006 Semtech Corp EClamp2356C PRELIMINARY ± ± www.semtech.com µ ...

Page 3

... Capacitance vs. Reverse Voltage (Normalized to 2.5 volts) 1.6 1.4 1.2 1 0.8 0.6 0.4 0 0.5 1 1.5 2 2.5 Reverse Voltage (V) 2006 Semtech Corp. TM CH1 S21 1: -8.7543 dB 350.000 MHz 2: -16.311 dB 900 MHz 3: -28.474 dB 1.8 GHz 1 4: -25.224 dB 2.5 GHz START . 030 MHz STOP 000 . 000 000 MHz 3 105 ...

Page 4

... The grid courtyard is intended to encompass the land pattern and the component body that is centered in the land pattern. When placing parts on a PCB, the highest recommended density is when one courtyard touches another. 2006 Semtech Corp. TM Pin Identification and Configuration (Ball Side View ...

Page 5

... The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. 2006 Semtech Corp. TM Recommended NSMD Pad and Stencil Aperture Assembly Guideline for Pb-Free Soldering The following are recommendations for the assembly ...

Page 6

... PROTECTION PRODUCTS - EMIClamp Applications Information 2006 Semtech Corp. TM EClamp2356C EClamp2356C EClamp2356C EClamp2356C Implementation Example 6 EClamp2356C PRELIMINARY www.semtech.com ...

Page 7

... This equip- ment has the capability to sweep the device from 3kHz to 3GHz. The analyzer’s source (R equal to the load (R ) impedance which is equal Connector (Output) 50 Ohms 2006 Semtech Corp. TM CH1 S21 order to obtain -12 dB -18 dB -24 dB -30 dB traces ...

Page 8

... PROTECTION PRODUCTS - EMIClamp Outline Drawing - Bump Flip Chip INDEX AREA A1 CORNER 0.10 C 0.30-0.50 C NOTES Land Pattern - Bump Flip Chip 25X Ø0.275 2006 Semtech Corp 2.60±0.10 2.60±0. 25X Ø0.315±0.020 0.50 CONTROLLING DIMENSIONS ARE IN MILLIMETERS REFERENCE JEDEC REGISTRATION MO-211. ...

Page 9

... The coating is laser markable and increases mechanical durability. This material is compliant with UL 94V-0 flammability requirements. Tape and Reel Specification Tape Specifications 2006 Semtech Corp. TM Ordering Information EMIClamp and EClamp are marks of Semtech Corporation Device Orientation in Tape 9 EClamp2356C PRELIMINARY ...

Page 10

... PROTECTION PRODUCTS - EMIClamp Contact Information Phone: (805)498-2111 FAX (805)498-3804 2006 Semtech Corp. TM Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 10 EClamp2356C PRELIMINARY www.semtech.com ...

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