ECLAMP2356C.WCT Semtech, ECLAMP2356C.WCT Datasheet - Page 4

• Manufacturer Part Number: ECLAMP2356C.WCT
• Manufacturer: Semtech

Specifications of ECLAMP2356C.WCT

• Attenuation (max): 20dB
• Mounting Style: Surface Mount
• Termination: Flat Style
• Operating Temp Range: -40C to 85C
• Lead Free Status / RoHS Status: Compliant

Device Connection Options
The EClamp2356C has solder bumps located in a 5 x 5
matrix layout on the active side of the device. The
bumps are designated by the numbers 1 - 5 along the
horizontal axis and letters A - E along the vertical axis.
The input of the lines to be protected are connected at
bumps A1 - A5 and B1 - B5. The line outputs are
connected at bumps D1 - D5 and E1 - E5. Bumps C1 -
C5 are connected to ground. All path lengths should
be kept as short as possible to minimize the effects of
parasitic inductance in the board traces.
Flip Chip TVS
Flip Chip TVS are wafer level chip scale packages. They
eliminate external plastic packages and leads and thus
result in a significant board space savings. Manufactur-
ing costs are minimized since they do not require an
intermediate level interconnect or interposer layer for
reliable operation. They are compatible with current pick
and place equipment further reducing manufacturing
costs. Certain precautions and design considerations
have to be observed however for maximum solder joint
reliability. These include solder pad definition, board
finish, and assembly parameters.
Printed Circuit Board Mounting
Non-solder mask defined (NSMD) land patterns are
recommended for mounting flip chip devices. Solder
mask defined (SMD) pads produce stress points at the
solder mask to solder ball interface that can result in
solder joint cracking when exposed to extreme fatigue
conditions. The recommended pad size is 0.275 ±
0.010 mm with a minimum solder mask opening of
0.325 mm.
Grid Courtyard
The recommended grid placement courtyard is 2.7 x
2.7 mm. The grid courtyard is intended to encompass
the land pattern and the component body that is
centered in the land pattern. When placing parts on a
PCB, the highest recommended density is when one
courtyard touches another.
PROTECTION PRODUCTS - EMIClamp
Applications Information
2006 Semtech Corp.
TM
4
Notes
1) Device is not electrically symmetrical so input and output lines
can not be switched
2) Bumps C1 - C5 must be electrically connected on the PCB
Pin Identification and Configuration (Ball Side View)
B
D
A
C
E
1
1
1
1
1
P
-
-
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-
-
-
A
C
B
D
E
5
5
5
5
5
Layout Example (Ball Side View)
6
A1
1
1
6
7
2
2
Input (LCD Side)
O
Output (System Board)
O
n I
7
8
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EClamp2356C
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9
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PRELIMINARY
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