EMIF01-TV01F3 STMicroelectronics, EMIF01-TV01F3 Datasheet - Page 6

• Manufacturer Part Number: EMIF01-TV01F3
• Manufacturer: STMicroelectronics

Specifications of EMIF01-TV01F3

• Mounting Style: Surface Mount
• Termination: Flat Style
• Lead Free Status / RoHS Status: Compliant

Ordering information
Note:
5
6/8
Figure 13. Flip Chip tape and reel specification
More information is available in the application notes:
AN2348: “STMicroelectronics 400 micro-metre Flip Chip: Package description and
recommendation for use”
AN1751: “EMI filters: Recommendations and measurements”
Ordering information
Table 3.
Figure 11. Footprint
EMIF01-TV01F3
Order code
Solder stencil opening :
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
220 µm recommended
All dimensions in mm
Ordering information
0.71 ± 0.05
Marking
Dot identifying Pin A1 location
HC
Package
Flip Chip
User direction of unreeling
Figure 12. Marking
0.79 mg
Weight
4 ± 0.1
0.87
Dot
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
4 ± 0.1
Base qty
5000
Ø 1.5 ± 0.1
x
y
EMIF01-TV01F3
w
Tape and reel 7”
x
Delivery mode
w
z