EMIF01-1003M3_10 STMICROELECTRONICS [STMicroelectronics], EMIF01-1003M3_10 Datasheet
EMIF01-1003M3_10
Related parts for EMIF01-1003M3_10
EMIF01-1003M3_10 Summary of contents
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... Basic cell configuration Input C LINE Description The EMIF01-1003M3 line highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference. This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges all pins. ...
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... Tolerance ± 10 MHz line R DC OSC S21 F = 900 MHz 2/11 = 25° C unless otherwise specified) amb Parameter RM = 25° C) amb Test conditions Doc ID 13976 Rev 2 EMIF01-1003M3 Value 15 8 125 - -55 to +150 ...
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... EMIF01-1003M3 Figure 4. S21 attenuation measurement ( bias dB 0.00 -5.00 -10.00 -15.00 -20.00 -25.00 F (Hz) -30.00 100.0k 1.0M 10.0M I-O Figure 6. ESD response to IEC 61000-4-2 (+15 kV air discharge) Figure 5. 3.50E+01 3.00E+01 2.50E+01 2.00E+01 1.50E+01 1.00E+01 5.00E+00 0.00E+00 100.0M 1.0G Figure 7. INPUT OUTPUT Doc ID 13976 Rev 2 Characteristics Line capacitance versus reverse voltage applied (typical value) ...
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... Application schematic 2 Application schematic Figure 8. Application schematic Keypad protection Key_Col_y 4/11 Key_Row_1 IN OUT GND Key_Row_2 IN OUT GND IN OUT GND Doc ID 13976 Rev 2 EMIF01-1003M3 ...
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... EMIF01-1003M3 3 Ordering information Figure 9. Ordering information scheme EMI Filter Number of lines Information x = resistance value (Ohms z = capacitance value / 10(pF) Package M3 = SOT-883 EMIF ) Doc ID 13976 Rev 2 Ordering information yy - xxx z Mx 5/11 ...
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... ECOPACK trademark. Table 3. SOT-883 dimensions Figure 10. Footprint (dimensions in mm) Figure 11. Marking 0.40 0.20 0.15 6/11 E Ref 0.40 0.50 0.40 Doc ID 13976 Rev 2 EMIF01-1003M3 Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. 0.45 0.50 0.18 0.00 0.05 0.00 0.10 0.15 0.20 0.04 0.06 0.45 0.50 0.55 0.18 0.20 0.60 0.24 1.00 0.39 0.35 0.14 0.65 0.26 0.20 0.25 0.30 0.08 0.10 0.20 ...
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... EMIF01-1003M3 Figure 12. Tape and reel specification 0.55 ± 0.05 All dimensions in mm Note: Product marking may be rotated by 90° for assembly plant differentiation case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark used for this purpose. ...
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... Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed 4. Solder paste with fine particles: powder particle size is 20-45 µm. 8/ ≥ ---- - = 1.5 T × ≥ = --------------------------- - 0. Doc ID 13976 Rev 2 EMIF01-1003M3 ...
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... EMIF01-1003M3 5.3 Placement 1. Manual positioning is not recommended recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. Standard tolerance of ± 0. recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages ...
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... The marking can be rotated by 90° to diferentiate assembly location 7 Revision history Table 5. Document revision history Date 07-Oct-2007 03-Nov-2010 10/11 Marking Package (1) F SOT-883 0.96 mg Revision 1 Initial release. 2 Updated base quantity Doc ID 13976 Rev 2 EMIF01-1003M3 Weight Base qty Delivery mode 12000 Tape and reel (7”) Changes Table 4. ...
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... EMIF01-1003M3 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...