EMIF02-MIC03F2 STMicroelectronics, EMIF02-MIC03F2 Datasheet

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EMIF02-MIC03F2

Manufacturer Part Number
EMIF02-MIC03F2
Description
Manufacturer
STMicroelectronics
Datasheet

Specifications of EMIF02-MIC03F2

Mounting Style
Surface Mount
Termination
Flat Style
Operating Temp Range
-40C to 85C
Product Height (mm)
0.65mm
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
EMIF02-MIC03F2
Manufacturer:
ST
Quantity:
54 000
Part Number:
EMIF02-MIC03F2
Manufacturer:
SEOUL
Quantity:
136
Part Number:
EMIF02-MIC03F2
Manufacturer:
ST
0
Part Number:
EMIF02-MIC03F2A7
Manufacturer:
ST
0
MAIN PRODUCT CHARACTERISTICS:
Where EMI filtering in ESD sensitive equipment is
required :
DESCRIPTION
The EMIF02-MIC03 is a highly integrated device
designed to suppress EMI/RFI noise in all systems
subjected to electromagnetic interferences. The
EMIF02 Flip-Chip packaging means the package
size is equal to the die size.
This filter includes an ESD protection circuitry
which prevents damage to the application when
subjected to ESD surges up 15 kV.
BENEFITS
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC 61000-4-2
Level 4 on input pins
Level 1 on output pins 2 kV (air discharge)
MIL STD 883E - Method 3015-6 Class 3
TM: IPAD is a trademark of STMicroelectronics.
October 2004
BASIC CELL CONFIGURATION
Mobile phones and communication systems
Computers, printers and MCU Boards
EMI symmetrical (I/O) low-pass filter
High efficiency in EMI filtering
Very low PCB space consuming:
1.07 mm x 1.47 mm
Very thin package: 0.65 mm
High efficiency in ESD suppression
High reliability offered by monolithic integration
High reducing of parasitic elements through
integration & wafer level packaging
Input
®
IPAD™
GND
15 kV (air discharge)
8 kV (contact discharge)
2 kV (contact discharge)
Low-pass Filter
GND
REV. 1
PIN CONFIGURATION (bump side)
GND
AND ESD PROTECTION
EMIF02-MIC03F2
Flip-Chip package
2 LINE EMI FILTER
O2
I2
3 2
Output
GND
O1
I1
1
Ri/o = 68
Cline = 100 pF
A
B
C
1/6

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EMIF02-MIC03F2 Summary of contents

Page 1

... Level 1 on output pins 2 kV (air discharge (contact discharge) MIL STD 883E - Method 3015-6 Class 3 BASIC CELL CONFIGURATION Input GND TM: IPAD is a trademark of STMicroelectronics. October 2004 AND ESD PROTECTION PIN CONFIGURATION (bump side) Low-pass Filter GND GND REV. 1 EMIF02-MIC03F2 2 LINE EMI FILTER Flip-Chip package GND Output Ω ...

Page 2

... EMIF02-MIC03F2 ABSOLUTE RATINGS (limiting values) Symbol Parameter and test conditions T Maximum junction temperature j T Operating temperature range op T Storage temperature range stg ELECTRICAL CHARACTERISTICS (T Symbol Parameter V Breakdown voltage BR I Leakage current @ Stand-off voltage RM V Clamping voltage CL R Dynamic impedance d I Peak pulse current ...

Page 3

... V(in) and one output V(out). Fig. 5: Line capacitance versus applied voltage. C(pF) 140 120 100 ( ® Fig. 4: ESD response to IEC61000-4-2 (–15kV air discharge) on one input V(in) and one output V(out). F=1MHz V =30mV osc RMS T =25° EMIF02-MIC03F2 3/6 ...

Page 4

... EMIF02-MIC03F2 Aplac model Rbump Lbump IN1 model = D1 model = D1 IN2 Rbump Lbump EMIF02-MIC03F1 model Aplac parameters Model D1 CJO=Cdiode1 BV=7 IBV=1u IKF=1000 IS=10f ISR=100p N=1 M=0.3333 RS=0.7 VJ=0.6 TT=50n ORDER CODE EMIF EMI Filter Number of lines x: resistance value (Ohms) z: capacitance value / 10(pF) 4/6 ...

Page 5

... Solder stencil opening : 330µm Solder mask opening recommendation : 340µm min for 300µm copper pad diameter MARKING Dot, ST logo xx = marking z = manufacturing location yww = datecode ® 315µm ± 50 1.07mm ± 50µm Copper pad Diameter : (y = year ww = week EMIF02-MIC03F2 650µm ± 5/6 ...

Page 6

... ECOPACK trademark. ECO- PACK specifications are available at: www.st.com. OTHER INFORMATION Ordering code Marking EMIF02-MIC03F2 FW Note: More packing informations are available in the application notes AN1235: ''Flip-Chip: Package description and recommendations for use'' AN1751: "EMI Filters: Recommendations and measurements" ...

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