M1-SYSMGMT-DEV-KIT-FP3 Actel, M1-SYSMGMT-DEV-KIT-FP3 Datasheet - Page 87

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M1-SYSMGMT-DEV-KIT-FP3

Manufacturer Part Number
M1-SYSMGMT-DEV-KIT-FP3
Description
MCU, MPU & DSP Development Tools System Management Development Kit
Manufacturer
Actel
Datasheet

Specifications of M1-SYSMGMT-DEV-KIT-FP3

Processor To Be Evaluated
AFS1500-FG484
Interface Type
RS-232, USB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Board Stackup
M1 System Management Board User’s Guide
The Fusion evaluation board is a 14-layer board. The stackup of each layer of copper is shown in
layers use 2 oz. weight copper to allow for higher currents to be passed; other layers use 1 oz. or 0.5 oz. weight copper.
The thicknesses of the copper layers is shown in mils (thousandths of an inch) next to each layer.
Analog signals require good grounding when used for temperature and current monitoring due to the very small signal
values involved. The board stackup allows the best possible signal integrity. Use of the same layer by split analog and
digital ground planes stops digital ground bounce from affecting analog ground bounce, which would occur if an entire
layer of digital ground was placed above an entire layer of analog ground.
The M1 System Management Board has multiple ground planes, one for each signal layer, and a power plane above each
signal layer to allow construction of microstrip and stripline for impedance control. Each ground layer is split into a
digital ground and an analog ground. There are four separate ground planes used in the M1 System Management Board.
The geometry of the analog section and the digital section in each ground plane is the same across ground planes (the
digital areas overlap only other digital areas, and the analog areas overlap only other analog areas) to minimize cross-
coupling between analog and digital grounds between the layers. To prevent earth loops, each layer has the analog and
digital grounds connected at only one point, which is common between all layers.
.094” +/- .10”
(NOM)
Figure D-1. Board Stackup
Figure
D-1. Some
D
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