TGA8310-SCC TriQuint, TGA8310-SCC Datasheet - Page 14

• Manufacturer Part Number: TGA8310-SCC
• Description: Wireless Accessories 2.0-20GHz LNA AGC
• Manufacturer: TriQuint

Specifications of TGA8310-SCC

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1004329

Reflow process assembly notes:
Component placement and adhesive attachment assembly notes:
Interconnect process assembly notes:
TriQuint Semiconductor Texas Phone : [phone]
Use AuSn (80/20) solder with limited exposure to temperatures at or above 300 C.
An alloy station or conveyor furnace with reducing atmosphere should be used.
No fluxes should be utilized.
Coefficient of thermal expansion matching is critical for long-term reliability.
Devices must be stored in a dry nitrogen atmosphere.
Vacuum pencils and/or vacuum collets are the preferred method of pick up.
Air bridges must be avoided during placement.
The force impact is critical during auto placement.
Organic attachment can be used in low-power applications.
Curing should be done in a convection oven; proper exhaust is a safety concern.
Microwave or radiant curing should not be used because of differential heating.
Coefficient of thermal expansion matching is critical.
Thermosonic ball bonding is the preferred interconnect technique.
Force, time, and ultrasonics are critical parameters.
Aluminum wire should not be used.
Discrete FET devices with small pad sizes should be bonded with 0.0007-inch wire.
Maximum stage temperature is 200 C.
Chip Assembly and Process Notes
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Product Data Sheet
TGA8310-SCC
June 12, 2002
14