MF1SPLUS8011DUD/02 NXP Semiconductors, MF1SPLUS8011DUD/02 Datasheet - Page 3
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MF1SPLUS8011DUD/02
Manufacturer Part Number
MF1SPLUS8011DUD/02
Description
RFID Modules & Development Tools MIFARE PLUS S 4K SMART CARD
Manufacturer
NXP Semiconductors
Datasheet
1.MF1SPLUS6001DUD03.pdf
(17 pages)
Specifications of MF1SPLUS8011DUD/02
Security
MIFARE CRYPTO1, AES
Product
Smart Card
Data Rate
848 Kbps
Antenna
On-Board
NXP Semiconductors
5. Ordering information
Table 2.
MF1SPLUSX0Y1_SDS_31
Product short data sheet
PUBLIC
Type number
MF1SPLUS8001DUD/03 FFC
MF1SPLUS8001DA4/03
MF1SPLUS8011DUD/03 FFC
MF1SPLUS8011DA4/03
MF1SPLUS8021DUD/03 FFC
MF1SPLUS8021DA4/03
MF1SPLUS6001DUD/03 FFC
MF1SPLUS6001DA4/03
MF1SPLUS6011DUD/03 FFC
MF1SPLUS6011DA4/03
MF1SPLUS6021DUD/03 FFC
MF1SPLUS6021DA4/03
Ordering information
Package
Commercial
Name
MOA4
MOA4
MOA4
MOA4
MOA4
MOA4
Name
-
-
PLLMC
-
-
-
PLLMC
-
PLLMC
PLLMC
PLLMC
PLLMC
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 19 April 2010
Description
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
plastic leadless module carrier package; 35 mm wide tape,
4 kB EEPROM, 7-byte UID
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
plastic leadless module carrier package; 35 mm wide tape,
4 kB EEPROM, 4-byte UID
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
UID0 = XFh according to ISO/IEC 14443-3
plastic leadless module carrier package; 35 mm wide tape,
4 kB EEPROM, 4-byte UID, UID0 = XFh according to
ISO/IEC 14443-3
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
plastic leadless module carrier package; 35 mm wide tape,
2 kB EEPROM, 7-byte UID
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
plastic leadless module carrier package; 35 mm wide tape,
2 kB EEPROM, 4-byte UID
8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format) see
UID0 = XFh according to ISO/IEC 14443-3
plastic leadless module carrier package; 35 mm wide tape,
2 kB EEPROM, 4-byte UID, UID0 = XFh according to
ISO/IEC 14443-3
187031
Ref.
Ref.
Ref.
Ref.
Ref.
Ref.
3, 4 kB EEPROM, 7-byte UID
3, 4 kB EEPROM, 4-byte UID
3, 4 kB EEPROM, 4-byte UID,
3, 2 kB EEPROM, 7-byte UID
3, 2 kB EEPROM, 4-byte UID
3, 2 kB EEPROM, 4-byte UID,
Mainstream contactless smart card IC
MF1SPLUSx0y1
© NXP B.V. 2010. All rights reserved.
Version
-
SOT500-2
-
SOT500-2
-
SOT500-2
-
SOT500-2
-
SOT500-2
-
SOT500-2
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