PZU16DB2,115 NXP Semiconductors, PZU16DB2,115 Datasheet

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PZUxDB2 series Dual Zener diodes Rev. 01 — 31 March 2008 1. Product profile 1.1 General description Dual isolated general-purpose Zener diodes in SOT353 (SC-88A) very small Surface-Mounted Device (SMD) standard plastic and dark-green plastic packages. 1.2 Features I Non-repetitive ...

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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PZU2.7DB2 to PZU24DB2 PZU2.7DB2/DG to PZU24DB2/DG [1] The series consists of 25 types with nominal working voltages from 2 [2] /DG: halogen-free plastic package 4. Marking Table 4. Type number PZU2.7DB2 PZU3.0DB2 PZU3.3DB2 PZU3.6DB2 PZU3.9DB2 PZU4.3DB2 PZU4.7DB2 PZU5.1DB2 PZU5 ...

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... NXP Semiconductors Table 4. Type number PZU10DB2 PZU11DB2 PZU12DB2 PZU13DB2 PZU14DB2 PZU15DB2 PZU16DB2 PZU18DB2 PZU20DB2 PZU22DB2 PZU24DB2 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China [2] /DG: halogen-free plastic package 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). ...

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... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol Per device R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm [3] Soldering points at pin 4 and pin 5. 7. Characteristics Table 7 ...

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... NXP Semiconductors Table 8. Characteristics per type; PZU2.7DB2 to PZU24DB2 and PZU2.7DB2/DG to PZU24DB2/ unless otherwise specified. j PZUxDB2 Working PZUxDB2/DG voltage V ( Min Max 8.2 8.02 8.36 9.1 8.85 9.23 10 9.77 10.21 11 10.76 11.22 12 11.74 12.24 13 12.91 13.49 14 13.7 14.3 15 14.34 14.98 16 15.85 16. ...

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... NXP Semiconductors ZSM ( (prior to surge) j Fig 1. Non-repetitive peak reverse power dissipation as a function of pulse duration; maximum values (mV/ 150 C j PZU2.7DB2 to PZU4.3DB2 PZU2.7DB2/DG to PZU4.3DB2/DG Fig 3. Temperature coefficient as a function of working current; typical values PZUXDB2_SER_1 Product data sheet 006aab215 300 I F (mA) ...

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... NXP Semiconductors (V) = 2.7 Z Z(nom) (mA) 3.0 10 3.3 3.6 3.9 4.3 4 PZU2.7DB2 to PZU6.2DB2 PZU2.7DB2/DG to PZU6.2DB2/DG Fig 5. Working current as a function of working voltage; typical values 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors , and is suitable for use in automotive applications ...

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... NXP Semiconductors 9. Package outline Fig 7. 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PZU2.7DB2 to PZU24DB2 PZU2.7DB2/DG to PZU24DB2/DG [1] For further information and the availability of packing methods, see PZUXDB2_SER_1 Product data sheet 2.2 1 ...

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... NXP Semiconductors 11. Soldering Fig 8. Fig 9. PZUXDB2_SER_1 Product data sheet 2.35 0. 0.50 solder lands (4 ) solder paste solder resist occupied area Dimensions in mm Reflow soldering footprint SOT353 (SC-88A) 2.25 4.50 2.70 0.70 solder lands solder resist transport direction during soldering occupied area Dimensions in mm Wave soldering footprint SOT353 (SC-88A) Rev. 01 — ...

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... NXP Semiconductors 12. Revision history Table 10. Revision history Document ID Release date PZUXDB2_SER_1 20080331 PZUXDB2_SER_1 Product data sheet Data sheet status Change notice Product data sheet - Rev. 01 — 31 March 2008 PZUxDB2 series Dual Zener diodes Supersedes - © NXP B.V. 2008. All rights reserved. ...

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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 7 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Packing information Soldering ...