PEMB24 T/R NXP Semiconductors, PEMB24 T/R Datasheet

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PEMB24 T/R

Manufacturer Part Number
PEMB24 T/R
Description
Digital Transistors TRNS DOUBL RET TAPE7
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PEMB24 T/R

Configuration
Dual
Transistor Polarity
PNP/PNP
Typical Input Resistor
100 KOhms
Typical Resistor Ratio
1
Mounting Style
SMD/SMT
Package / Case
SOT-666-6
Collector- Emitter Voltage Vceo Max
50 V
Peak Dc Collector Current
20 mA
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
PEMB24,115
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
PNP/PNP resistor-equipped transistors
Table 1.
I
I
I
I
I
I
I
Table 2.
Type number
PEMB24
PUMB24
Symbol
V
I
R1
R2/R1
O
CEO
PEMB24; PUMB24
PNP/PNP resistor-equipped transistors;
R1 = 100 k , R2 = 100 k
Rev. 02 — 2 September 2009
Built-in bias resistors
Simplifies circuit design
Reduces component count
Reduces pick and place cost
Low current peripheral driver
Control of IC inputs
Replacement of general-purpose transistors in digital applications
Product overview
Quick reference data
Parameter
collector-emitter voltage
output current (DC)
bias resistor 1 (input)
bias resistor ratio
Package
NXP
SOT666
SOT363
Conditions
open base
JEITA
-
SC-88
Min
-
-
70
0.8
NPN/PNP
complement
PEMD24
PUMD24
Typ
-
-
100
1
Product data sheet
Max
130
1.2
NPN/NPN
complement
PEMH24
PUMH24
50
20
Unit
V
mA
k

Related parts for PEMB24 T/R

PEMB24 T/R Summary of contents

Page 1

... Built-in bias resistors I Simplifies circuit design I Reduces component count I Reduces pick and place cost 1.3 Applications I Low current peripheral driver I Control of IC inputs I Replacement of general-purpose transistors in digital applications 1.4 Quick reference data Table 2. Symbol V CEO R2/R1 Product overview Package NXP ...

Page 2

... NXP Semiconductors 2. Pinning information Table 3. Pin Ordering information Table 4. Type number PEMB24 PUMB24 4. Marking Table 5. Type number PEMB24 PUMB24 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China PEMB24_PUMB24_2 Product data sheet PNP/PNP resistor-equipped transistors 100 100 k Pinning Description GND (emitter) TR1 ...

Page 3

... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor V CBO V CEO V EBO tot T stg amb Per device P tot [1] Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint. [2] Reflow soldering is the only recommended soldering method. ...

Page 4

... NXP Semiconductors 7. Characteristics Table 8. Characteristics unless otherwise specified. amb Symbol Parameter Per transistor I collector-base cut-off CBO current I collector-emitter CEO cut-off current I emitter-base cut-off EBO current h DC current gain FE V collector-emitter CEsat saturation voltage V off-state input voltage V I(off) V on-state input voltage V ...

Page 5

... NXP Semiconductors ( 150 C amb ( amb ( amb Fig 1. DC current gain as a function of collector current; typical values 10 V I(on) (1) (V) ( amb ( amb ( 100 C amb Fig 3. On-state input voltage as a function of collector current; typical values PEMB24_PUMB24_2 Product data sheet PNP/PNP resistor-equipped transistors 100 100 k ...

Page 6

... NXP Semiconductors 8. Package outline Plastic surface-mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 0.30 1.1 0.25 mm 0.1 0.20 0.8 0.10 OUTLINE VERSION IEC SOT363 Fig 5. Package outline SOT363 (SC-88) PEMB24_PUMB24_2 Product data sheet PNP/PNP resistor-equipped transistors 100 100 k ...

Page 7

... NXP Semiconductors Plastic surface-mounted package; 6 leads pin 1 index DIMENSIONS (mm are the original dimensions) UNIT 0.6 0.27 0.18 1.7 mm 0.5 0.17 0.08 1.5 OUTLINE VERSION IEC SOT666 Fig 6. Package outline SOT666 PEMB24_PUMB24_2 Product data sheet PNP/PNP resistor-equipped transistors 100 100 scale 1.3 1 ...

Page 8

... NXP Semiconductors 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PEMB24 SOT666 PUMB24 SOT363 PUMB24 SOT363 [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping ...

Page 9

... Document ID Release date PEMB24_PUMB24_2 20090902 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 5 “Package outline SOT363 • Figure 6 “Package outline ...

Page 10

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 11

... NXP Semiconductors 13. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Packing information Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 11 Legal information ...

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