PZU9.1B1,115 NXP Semiconductors, PZU9.1B1,115 Datasheet - Page 8
![DIODE ZENER 9.1V 310MW SOD323F](/photos/5/26/52649/568-sc-90-_sod323f_sml.jpg)
PZU9.1B1,115
Manufacturer Part Number
PZU9.1B1,115
Description
DIODE ZENER 9.1V 310MW SOD323F
Manufacturer
NXP Semiconductors
Datasheet
1.PZU3.3B115.pdf
(12 pages)
Specifications of PZU9.1B1,115
Package / Case
SC-90, SOD-323F
Voltage - Zener (nom) (vz)
9.1V
Voltage - Forward (vf) (max) @ If
1.1V @ 100mA
Current - Reverse Leakage @ Vr
500nA @ 6V
Tolerance
±2%
Power - Max
310mW
Impedance (max) (zzt)
10 Ohm
Mounting Type
Surface Mount
Operating Temperature
-65°C ~ 150°C
Zener Voltage
8.745 V
Voltage Tolerance
2 %
Voltage Temperature Coefficient
5.5 mV / K
Power Dissipation
550 mW
Maximum Reverse Leakage Current
500 uA
Maximum Zener Impedance
10 Ohms
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-3943-2
934059798115
PZU9.1B1 T/R
934059798115
PZU9.1B1 T/R
NXP Semiconductors
8. Package outline
9. Packing information
10. Soldering
PZUXB_SER_2
Product data sheet
Table 10.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package
PZU2.4B to
PZU36B
Fig 5.
Fig 6.
For further information and the availability of packing methods, see
Package outline SOD323F (SC-90)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering footprint SOD323F (SC-90)
1.65
Packing methods
SOD323F
0.95
Rev. 02 — 15 November 2009
Dimensions in mm
0.50
(2×)
2.7
2.3
Description
4 mm pitch, 8 mm tape and reel
1.8
1.6
3.05
2.80
2.10
1.60
1.35
1.15
1
2
Single Zener diodes in a SOD323F package
0.40
0.25
0.50
001aab169
0.60
0.5
0.3
Section
0.80
0.65
0.25
0.10
PZUxB series
[1]
Packing quantity
3000
-115
04-09-13
14.
solder lands
solder resist
occupied area
solder paste
© NXP B.V. 2009. All rights reserved.
10000
-135
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